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Study of PMMA thermal bonding

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Abstract

The bond strength dependence on bonding temperature and bonding pressure in traditional thermal bonding and surface modification bonding of PMMA is investigated. The results show that the bond strength of the latter bonding method is larger than the former. The effects of post-annealing and aging on bond strength are also demonstrated. Then the bonding parameters of temperature and pressure are optimized, and typical bond strength of 1 MPa is obtained at bonding temperature of 95°C, bonding pressure at 2 MPa, bonding time for 3 min and 50°C post-annealing for 2 h. The successful bonded microfluidic device was obtained through this optimized thermal bonding method.

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References

  • Han A, Wang O, Graff M et al (2003) Multi-layer plastic/glass microfluidic systems containing electrical and mechanical functionality. Lab Chip 3:150–157

    Article  Google Scholar 

  • Zhao DS, Roy B, McCormick MT et al (2003) Rapid fabrication of a poly (dimethylsiloxane) microfluidic capillary gel electrophoresis system utilizing high precision machining. Lab Chip 3:93–99

    Article  Google Scholar 

  • Fiorini GS, Jeffries GDM, Lim DSW et al (2003) Fabrication of thermoset polyester microfluidic devices and embossing masters using rapid prototyped poly dimethylsiloxane molds. Lab Chip 3:158–163

    Article  Google Scholar 

  • Becker H, Locascio LE (2002) Review: polymer microfluidic devices. Talanta 56:267–287

    Article  Google Scholar 

  • Lee HS, Kim DS, Kwon TH (2003) A novel low temperature bonding technique for plastic substrates using X-ray irradiation. In: Digest. tech. papers transducers ’03 conference, Boston, 8–12 June 2003, pp 1331–1334

  • Roberts MA, Rossier JS, Bercier P et al (1997) UV laser machined polymer substrates for the development of microdiagnostic systems. Anal Chem 69:1973–1978

    Article  Google Scholar 

  • Kelly RT, Woolley AT (2003) Thermal bonding of polymeric capillary electrophoresis microdevices in water. Anal Chem 75:1941–1945

    Article  Google Scholar 

  • Zhu X, Liu G, Tian Y (2004) A new method of layer-to-layer bonding of PMMA. In: The 4th international workshop on microfactories (IWMF), Shanghai, 15–17 October 2004

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Authors and Affiliations

  1. National Synchrotron Radiation Laboratory, University of Science and Technology of China, Hefei, Anhui, 230029, People’s Republic of China

    Xuelin Zhu, Gang Liu, Yuhua Guo & Yangchao Tian

Authors
  1. Xuelin Zhu
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  2. Gang Liu
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  3. Yuhua Guo
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  4. Yangchao Tian
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Corresponding author

Correspondence to Yangchao Tian.

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Zhu, X., Liu, G., Guo, Y. et al. Study of PMMA thermal bonding. Microsyst Technol 13, 403–407 (2007). https://doi.org/10.1007/s00542-006-0224-x

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  • DOI: https://doi.org/10.1007/s00542-006-0224-x

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