Abstract
The laser is a joining tool which is particularly suitable for the application in microtechnology. The process variant laser transmission joining can be used both for welding thermoplastics and bonding of silicon and glass. The investigations presented in this paper cover detailed examinations of both processes. Concerning laser transmission welding of plastics it is examined how far the content of carbon black in the material influences the formation of the weld seam. It is shown that the optical depth of penetration, the weld seam width as well as the formation of the weld morphology differ with varying content of carbon black. Selective laser radiation bonding (SLB) is a novel method for joining silicon and glass based on the transmission heating of the interface of both joining partners and the thermo-chemical principles of silicon direct bonding. SLB shows advantages in reference to the thermal load of sensitive components like sensors and to the selectivity of the joining geometry. In this study the principle method of SLB and the latest advances like the integration of the thermal process control in the laser processing head will be presented. Also experimental test results of the process with constant laser power and thermal process control and the comparison of them will be shown.
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References
Klein H (2001) Laserschweißen von kunststoffen in der mikrotechnik, RWTH Aachen, Dissertation
Ehrenstein G (2004) Handbuch Kunststoffverbindungstechnik. München, Carl Hanser Verlag
Schulz J (2002) Werkstoff-, Prozess- und Bauteiluntersuchungen zum Laserdurchstrahlschweißen von Kunststoffen. Dissertation, RWTH Aachen
n .n (2003) Polypropylen-Bauteile verbinden, Kunststoffe 92(10):74–76
Mattus V, Roos R, Engel J (2001) Durchblick beim Durchstrahlen. Kunststoffe 91(10):158–163
Chen J-W, Hinz O (1999) Masken für kleines Feines. Laser-Praxis 5:26–31
Leister C (2000) Modulare diodenlasersysteme zum fügen von empfindlichen Bauteilen in der elektronik und mikrotechnik. Aachener Kolloquium für Lasertechnik, Aachen pp 303–313
Chen J-W (2000) Mit der maske in die mikrowelt. TAE aktuell 12:2–4
Tong QY, Gösele U (1999) Semiconductor Wafer Bonding. Verlag Wiley-Interscience Publication, New York, Chichester, Weinheim
Ulrich Dilthey, Anette Brandenburg (Hrsg.), Montage hybrider Mikrosysteme, Springer, Berlin, Heidelberg, New York 2005, pp 91–102
Kern W (Ed) Handbook of semiconductor wafer cleaning technology - science, technology, and applications. Noyes Publications, pp 19–21 1993
Wild MJ (2002) Lokal selektives bonden von silizium und glas mit laser. Dissertation, Shaker, Aachen pp 30–31
Sari F, Rupf M, Gillner A, Poprawe A, et al. (2005) Lasers in manufacturing 2005, Proceedings of the third international WLT-conference on lasers in manufacturing, Munich, Germany, June 2005, pp 791–796
Acknowledgements
The authors gratefully acknowledge the financial support of the Deutsche Forschungsgemeinschaft (DFG) within the Collaborative Research Centre SFB 440 “Assembly of Hybrid Microsystems”.
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An erratum to this article can be found at http://dx.doi.org/10.1007/s00542-006-0237-5
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Haberstroh, E., Hoffmann, WM., Poprawe, R. et al. 3 Laser transmission joining in microtechnology. Microsyst Technol 12, 632–639 (2006). https://doi.org/10.1007/s00542-006-0096-0
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DOI: https://doi.org/10.1007/s00542-006-0096-0