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Large-scale hot embossing

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Abstract

The hot embossing process is a flexible molding technique to produce delicate microstructures with high aspect ratios on thin layers. Large-scale hot embossing is one effective way to meet future requirements and produce high-quality microstructures at low costs. For this, however, principal changes of the molding process and molding tool design will be required. In the present paper, constructive solutions for large-scale hot embossing shall be described. Based on a simulation of the hot embossing process, solutions shall be presented that are aimed at reducing shrinkage of the molded parts and demolding forces and, hence, at avoiding damages of microstructures during demolding.

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Authors and Affiliations

  1. Forschungszentrum Karlsruhe, Institut für Mikrostrukturtechnik, Postfach 36 40, 76021, Karlsruhe, Germany

    M. Worgull & M. Heckele

  2. Konstruktion und Entwicklung von Mikrosystemen (KEmikro), RWTH Aachen, 52056, Aachen, Germany

    W. K. Schomburg

Authors
  1. M. Worgull
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  2. M. Heckele
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  3. W. K. Schomburg
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Corresponding author

Correspondence to W. K. Schomburg.

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Worgull, M., Heckele, M. & Schomburg, W.K. Large-scale hot embossing. Microsyst Technol 12, 110–115 (2005). https://doi.org/10.1007/s00542-005-0012-z

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  • DOI: https://doi.org/10.1007/s00542-005-0012-z

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