Abstract
SU8 photoresists are used widely in the development and fabrication of the high-aspect-ratio micro-structure. However, SU8 process is difficult to repeat when the film thickness and aspect ratio are increasing. In this paper, the soft bake is investigated. The retained solvent level in SU8 film is studied by using the theory of free volume and diffusion process. The result shows that the proper and uniform solvent level in the photoresist film is crucial to achieve good SU8 microstructures in the ultra-thick film process. The microstructure with 5 μm linewidth and aspect ratios larger than 50 was obtained.
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This work is supported by the National 863 Project (2002AA404130) of China.
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Liu, G., Tian, Y. & Kan, Y. Fabrication of high-aspect-ratio microstructures using SU8 photoresist. Microsyst Technol 11, 343–346 (2005). https://doi.org/10.1007/s00542-004-0452-x
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DOI: https://doi.org/10.1007/s00542-004-0452-x