Micro wire EDM for high aspect ratio 3D microstructuring of ceramics and metals

Abstract

Components for microsystems are basically produced using processes from the semiconductor technology or by LIGA. Silicon serves as basic material for this components. The material properties of silicon often don’t achieve the demands of for example: micro-surgery, biotechnology, fluidics or high temperature environments. High volume production by replication techniques also needs tool materials with more adapted properties and high lifetime. Therefore materials such as polymers, metals, composits and ceramics becoming more and more important in MST and there is an increasing requirement of suitable manufacturing techniques and processes for this materials. For complex-shapes electro-discharge-machining (EDM) can be applied. Wire EDM (WEDM) is usefull for cutting shapes in materials with an minimum conductivity of about 0,01 s/cm. In our department we use wire diameters down to 20 μm. We will show the newest application from our department made by very fine wires on an universal WEDM machine.