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High-precision micro-through-hole array in quartz glass machined by infrared picosecond laser

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Abstract

Circle and triangle micro-through-hole arrays without cracks, chips, and debris were machined in 0.3-mm-thick quartz glass by picosecond laser (wavelength = 1064 nm, pulse width ~12 ps) in air ambient. The diameter of each circle through-hole was 550 μm, and the side length of each triangle hole is 500 μm; 30 μm spacing between the adjacent hole edges and the smooth machined surface with R a = 0.8 μm roughness depicted the high precision of the high-density micro-through-hole arrays. The fundamental properties of the ps laser processing of quartz glass were investigated. The laser ablation threshold fluence of the quartz glass was determined as 3.49 J/cm2. Based on the fundamental investigation, a quantitative design of the cutting path for micro-machining of the through-holes with various geometries in quartz glass was developed. The work presents a more practical ps laser micro-machining technique for micro-through-hole arrays in glass-like materials for industrial application due to the precise quality, flexibility in geometries, ease of manipulation, and large-scale application.

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Acknowledgments

This work is supported by National Science Foundation of China (51275011) and New Century Excellent Talents in University (NCET-10-0007). Acknowledgment is also made to Scientific Research Program of Beijing Municipal Commission of Education (KZ20131005005).

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Authors and Affiliations

  1. Institute of Laser Engineering, Beijing University of Technology, Beijing, 100124, China

    Lingfei Ji, Yan Hu, Jian Li, Wenhao Wang & Yijian Jiang

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  1. Lingfei Ji
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  2. Yan Hu
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  3. Jian Li
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  4. Wenhao Wang
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Correspondence to Lingfei Ji.

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Ji, L., Hu, Y., Li, J. et al. High-precision micro-through-hole array in quartz glass machined by infrared picosecond laser. Appl. Phys. A 121, 1163–1169 (2015). https://doi.org/10.1007/s00339-015-9482-8

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  • DOI: https://doi.org/10.1007/s00339-015-9482-8

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