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Microstructure characterization and thermal behavior around crack tip under electropulsing

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Abstract

Electropulsing treatment is a practical method to arrest crack propagation. The microstructure characterization and research on the forming mechanism are difficult due to the small affected area (0.01–1 mm2), high-temperature gradient (102 K/mm) and change rate (104–107 K/s). In this paper, the 1045 steel plate with a preexisting crack subjected to high-voltage pulses was investigated. The surface morphologies and microstructure around the crack tip were observed using optical microscopy and scanning electron microscopy. Experimental results showed that the material around the tip melted, splashed and blunted under electropulsing treatment. The microstructure around the molten hole was divided into four distinct regions. An electro-thermal coupled model considering material ejection, cavity formation, current oscillation and temperature-dependent material properties was proposed to investigate the dynamic formation process of molten hole and gradient microstructure. The uneven temperature distribution, high cooling rate and insufficient carbon diffusion led to the formation of gradient microstructure.

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Acknowledgments

This work was financially supported by the National Basic Research Program of China (973 Program) (No. 2011CB013404). The authors are grateful to State Key Laboratory of Tribology and Pro. Shengzhi Hao from Dalian University of Technology for facility support.

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Authors and Affiliations

  1. Beijing Key Lab of Precision/Ultra-precision Manufacturing Equipments and Control, Tsinghua University, Beijing, 100084, China

    Shaopeng Wei, Gang Wang & Yiming Rong

  2. School of Materials Science and Engineering, Dalian University of Technology, Dalian, 116023, China

    Dewei Deng

  3. Department of Mechanical Engineering, Worcester Polytechnic Institute, Worcester, MA, 01609, USA

    Yiming Rong

Authors
  1. Shaopeng Wei
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  2. Gang Wang
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  3. Dewei Deng
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  4. Yiming Rong
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Correspondence to Gang Wang.

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Wei, S., Wang, G., Deng, D. et al. Microstructure characterization and thermal behavior around crack tip under electropulsing. Appl. Phys. A 121, 69–76 (2015). https://doi.org/10.1007/s00339-015-9383-x

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  • DOI: https://doi.org/10.1007/s00339-015-9383-x

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