Abstract
As displays and electronics evolve to become lighter, thinner, and more flexible, the choice of substrate continues to be critical to their overall optimization. The substrate directly affects improvements in the designs, materials, fabrication processes, and performance of advanced electronics. With their inherent benefits such as surface quality, optical transmission, hermeticity, and thermal and dimensional stability, glass substrates enable high-quality and long-life devices. As substrate thicknesses are reduced below 200 μm, ultra-slim flexible glass continues to provide these inherent benefits to high-performance flexible electronics such as displays, touch sensors, photovoltaics, and lighting. In addition, the reduction in glass thickness also allows for new device designs and high-throughput, continuous manufacturing enabled by R2R processes. This paper provides an overview of ultra-slim flexible glass substrates and how they enable flexible electronic device optimization. Specific focus is put on flexible glass’ mechanical reliability. For this, a combination of substrate design and process optimizations has been demonstrated that enables R2R device fabrication on flexible glass. Demonstrations of R2R flexible glass processes such as vacuum deposition, photolithography, laser patterning, screen printing, slot die coating, and lamination have been made. Compatibility with these key process steps has resulted in the first demonstration of a fully functional flexible glass device fabricated completely using R2R processes.
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References
S. Hoehla, S. Garner, M. Hohmann, O. Kuhls, X. Li, A. Schindler, N. Fruehauf, Active matrix color-LCD on 75 μm thick flexible glass substrates. IEEE J. Disp. Technol. 8, 309–316 (2012)
S.M. Garner, M. He, P.-Y. Lo, C.-F. Sung, C.-W. Liu, Y.-M. Hsieh, R. Hsu, J.-M. Ding, J.-P. Hu, Y.-J. Chan, J.C. Lin, X. Li, M. Sorenson, J. Li, P. Cimo, K.T. Kuo, Electrophoretic displays fabricated on ultra-slim flexible glass substrates. IEEE J. Disp. Technol. 8, 590–595 (2012)
S.M. Garner, K.-W. Wu, Y.C. Liao, J.W. Shiu, Y.S. Tsai, K.T. Chen, Y.C. Lai, C.-C. Lai, Y.-Z. Lee, J.C. Lin, X. Li, P. Cimo, Cholesteric liquid crystal display with flexible glass substrates. IEEE J. Disp. Technol. 9, 644–650 (2013)
D.A. Mourey, R.L. Hoffman, S.M. Garner, A. Holm, B. Benson, G. Combs, J.E. Abbott, X. Li, P. Cimo, T.R. Koch, Amorphous oxide transistor electrokinetic reflective display on flexible glass. IDW 2011, Nogoya, Dec 2011
S. Won, Poly Si TFT on microsheet. ECS Trans. 25, 255–258 (2009)
K. Kondo, Y. Okabe, H. Ogata, Y. Shika, A. Hara, High-performance LT poly-Si TFTs fabricated on flexible glass. IDW 2011, Nogoya, Dec 2011
S. Garner, G. Merz, J. Tosch, C. Chang, J. Lin, C. Kuo, J. Tseng, M. Chang, S. Lewis, R. Kohler, L. Tian, L. Simpson, M. Owens, X. Li, S. Huang, J. Shih, A. Wei, M.C. Lin, C.S. Huang, H.T. Lin, C.L. Lin, S.Y. Chang, C.T. Wang, J. Shen, C.H. Hsiao, S.T. Lu, J. Hu, C.T. Liu, H.Y. Lin, W.S. Yang, C.C. Su, J. Switzer, J. Steiner, Ultra-Slim Flexible Glass for Electronic Application. 2012 MRS Fall Meeting, Boston, Nov. 28, 2012
M. Toerker, P. Freitag, J. Hesse, S. Richter, C. May, Transparent OLEDs for signage and decorative lighting applications, LOPE-C, June 19–21, 2012
W.L. Rance, J.M. Burst, M.O. Reese, D.M. Meysing, C.A. Wolden, T.A. Gessert, S. Garner, P. Cimo, T.M. Barnes, The use of Corning® Willow™ glass for flexible CdTe solar cells, 39th IEEE Photovoltaic Specialists Conference, Tampa, June 19, 2013
C.-Y. Peng, T.P. Dhakal, S.M. Garner, P. Cimo, S. Lu, C.R. Westgate, Strained growth of aluminium-doped zinc oxide on flexible glass substrate and degradation studies under cyclic bending conditions. IEEE Trans. Device Mater. Reliability 14, 121–126 (2014)
M. Okandan, “Microsystems enabled PV” 2013 Flexible and Printed Electronics Conference, Phoenix, Jan 29–Feb 1, 2013
S. Garner, G. Merz, J. Tosch, S. Smith, D. Marshall, X. Li, J. Matusick, E. Rebrosova, M. Rebros, B. Bazuin, M. Joyce, J. Steiner, J. Switzer, D. Yepez, Ultra-slim flexible glass substrates for organic PV & flexible electronics, Flexible Electronics Conference 2012, Phoenix, February 2012
H. Tamagaki, Y. Ikari, N. Ohba, Roll-to-roll sputter deposition on flexible glass substrates. Surf. Coat. Tech. 241, 138–141 (2014)
J. Chen, C.T. Liu, Technology advances in flexible displays and substrates. IEEE Access. 1, 150–158 (2013)
X. Hu, Z. Song, W. Liu, F. Qin, Z. Zhang, H. Wang, Chemical mechanical polishing of stainless steel foil as flexible substrate. Appl. Surf. Sci. 258, 5798–5802 (2012)
J.-S. Yoo, S.-H. Jung, Y.-C. Kim, S.-C. Byun, J.-M. Kim, N.-B. Choi, S.-Y. Yoon, C.-D. Kim, Y.-K. Hwang, I.-J. Chung, “Highly flexible AM-OLED display with integrated gate driver using amorphous silicon TFT on ultrathin metal foil”. J. Disp. Technol. 6, 565–570 (2010)
N. Morrison, R2R PECVD for next generation thin film electronic device and ultra high barrier applications, Flexible Electronics Conference 2014, Phoenix, Feb 2014
L. Moro, D. Boesch, X. Zeng, Barrier requirements and challenges to enable next gen flexible OLED, Flexible Electronics Conference 2014, Phoenix, Feb 2014
S. Garner, G. Merz, G.S. Glaesemann, J. Lin, L. Tian, E. Park, S. Logunov, X. Li, Flexible glass for device substrate and hermetic barrier applications, Council for Chemical Research’s 18th New Industrial Chemistry & Engineering Workshop, Arlington, VA, Sept 19, 2012
W.A. MacDonald, M.K. Looney, D. MacKerron, R. Eveson, K. Rakos, Designing and manufacturing substrates for flexible electronics. Plast. Rubber Compos. 37, 41–45 (2008)
K. Long, A.Z. Kattamis, I.-C. Cheng, H. Gleskova, S. Wagner, J.C. Sturm, M. Stevenson, G. Yu, M. O’Regan, Active-matrix amorphous-silicon TFT arrays at 180C on clear plastic and glass substrates for organic light-emitting displays. IEEE Transactions Electron. Devices 53, 1789–1796 (2006)
A.Z. Kattamis, I.-C. Cheng, K. Long, B. Hekmatshoar, K.H. Cherenack, S. Wagner, J.C. Sturm, S.M. Venugopal, D.E. Loy, S.M. O’Rourke, D.R. Allee, Amorhuos silicon thin-film transistor backplanes deposited at 200C on clear plastic for lamination to electrophoretic displays. J. Disp. Technol. 3, 304–308 (2007)
G.S. Glaesemann, S.T. Gulati, Design methodology for the mechanical reliability of optical fiber. Opt. Eng. 30, 709–715 (1991)
G. Scott Glaesemann, S.M. Garner, “Mechanical reliability of thin flexible glass sheets,” 34th Northeast Regional Meeting of the American Chemical Society, Binghamton, NY, Oct 5–7, 2006
X. Li, S. Garner, CO2 laser free-shape cutting of flexible glass substrates, ICALEO Annual Meeting 2012, Anaheim, Sept 25, 2012
X. Li, S. Garner, Laser cutting of flexible glass, CLEO 2014, San Jose, 2014
R.T. Tucker, S. Elmallah, M.T. Taschuk, A.L. Beaudry, J.M. LaForge, S. Garner, P. Cimo, M.J. Brett, “Robust ITO nanowire networks on flexible Corning® Willow® Glass,” 2014 Flexible and Printed Electronics Conference, Phoenix, Feb 4–6, 2014
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Garner, S., Glaesemann, S. & Li, X. Ultra-slim flexible glass for roll-to-roll electronic device fabrication. Appl. Phys. A 116, 403–407 (2014). https://doi.org/10.1007/s00339-014-8468-2
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DOI: https://doi.org/10.1007/s00339-014-8468-2