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Interfacial thermal contact resistance between aluminum nitride and copper at cryogenic temperature

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Abstract

The purpose of this study was to investigate the interfacial thermal contact resistance (ITCR) between aluminum nitride and copper. The ITCR was measured based on one-dimension steady-state heat conduction over a temperature range of 90–210 K and over a contact pressure range of 0.3–1.0 MPa. Our results show that the ITCR between aluminum nitride and copper decreases with increasing contact pressure, and increasing interfacial temperature. An ITCR model, which the influence of the surface layer on the ITCR is considered, is presented for prediction the ITCR.

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Abbreviations

C :

Specific heat per unit volume (kJ/kg m3)

F :

Force (N)

k :

Thermal conductivity (W/m K)

k b :

Boltzmann constant (1.3805 × 10−23 J/K)

q :

Heat flux (W/m2)

R :

Thermal contact resistance (K m2/W)

T :

Temperature (K)

v :

Average sound velocity (m/s)

α :

Transmission coefficient

δ:

Thickness of surface layer (m)

ΔT :

Temperature difference at the interface (K)

\( \hbar \) :

Planck’s constant divided by 2π(1.054496 × 10−34 J s)

λ :

Mean free path (m)

ω d :

Phonon Debye frequency (rad/s)

c :

Contact

i :

Interface

j :

Material number (j = 1, 2)

1:

Material 1

2:

Material 2

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Acknowledgments

The authors would like to thank National Nature Science Fund of China (Grant No. 51076165) for supporting this project.

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Authors and Affiliations

  1. School of Chemistry and Environment Engineering, Jianghan University, Wuhan, 430056, Peoples Republic of China

    Ling Shi & Xin-ming Yu

  2. Department of Mechanical Engineering, Naval University of Engineering, Wuhan, 430033, Peoples Republic of China

    Gang Wu

  3. The Institute of Energy and Power, Huazhong University of Science and Technology, Wuhan, 430074, Peoples Republic of China

    Hui-ling Wang

Authors
  1. Ling Shi
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  2. Gang Wu
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  3. Hui-ling Wang
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  4. Xin-ming Yu
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Correspondence to Ling Shi.

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Shi, L., Wu, G., Wang, Hl. et al. Interfacial thermal contact resistance between aluminum nitride and copper at cryogenic temperature. Heat Mass Transfer 48, 999–1004 (2012). https://doi.org/10.1007/s00231-011-0953-y

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  • DOI: https://doi.org/10.1007/s00231-011-0953-y

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