Abstract
Prolonged polishing deteriorates the shape accuracy of an optical element and reduces production efficiency simultaneously. In order to reduce the amount of polishing and polishing time, even obtain polish-free fine surfaces, a cerium oxide (CeO2) slurry-enhanced grinding (SEG) is investigated. However, the lack of in-depth mechanism explanation limits the optimization and application of SEG. In this research, a novel theoretical model was established to predict the surface roughness of the workpiece processed by CeO2 SEG. The modeling considered the effects of the protrusion height of active grains in the grinding wheel and the sizes and mass fractions of CeO2 particles in the grinding zone on undeformed chip thickness (UCT). Then, the mechanism of CeO2 SEG was investigated through the nanoindentation method. Indentation hardness and energy spectrum of the surface were estimated to verify the softened layer. The results showed that the model of surface roughness was well consistent with the experiment. CeO2 particle size significantly influenced the surface roughness than the mass fraction. The load-bearing effect of larger CeO2 particle size reduced the protruding height of the grinding wheel grains and reduced the UCT to a greater extent in the grinding process. The chemical reaction between CeO2 slurry and BK7 glass results in a softening layer which enhances the critical load and critical depth of the ductile–brittle transition of grinding. Finally, the optimized parameters were used for CeO2 SEG of ellipsoid BK7 optics and obtained the high surface quality.
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Abbreviations
- A 1 :
-
The area of part I
- A 2top:
-
The area of top of part II
- A 3bottom:
-
The area of bottom of part III
- α :
-
Geometrical factor of the indenter
- α 0 :
-
Top angle of the indenter
- a p :
-
Single grinding depth
- a p, total :
-
Total grinding depth
- c :
-
Lateral crack length
- C d :
-
Active abrasive number in unit area
- c m :
-
Median crack length
- D :
-
Average height of CeO2 particles distributed along the protruding direction of abrasive
- d :
-
Particle size of CeO2
- δ :
-
Volume fraction of diamond abrasive in the grinding wheel
- d g :
-
Equivalent spherical diameter of abrasive
- d max :
-
Maximum height of CeO2 particles distributed along the protruding direction of abrasive
- E (Ra)0.5 :
-
Predicted value of surface roughness when the particle size of CeO2 is 0.5 µm
- E (Ra)1 :
-
Predicted value of surface roughness when the particle size of CeO2 is 1 µm
- ϵ :
-
Active fraction of abrasive in the grinding process
- H :
-
Microhardness in nanoindentation
- K Id :
-
Dynamic fracture toughness
- l c :
-
Chip length
- M :
-
Mesh of grinding wheel
- μ :
-
Mean value
- N s :
-
Number of CeO2 particles in unit volume
- ω :
-
Mass fraction of CeO2 slurry
- P cd :
-
Dynamic impulse load
- φ :
-
Volume fraction of CeO2 slurry
- ρ :
-
Density of CeO2
- SEG:
-
Slurry-enhanced grinding
- σ :
-
Rayleigh parameter
- τ :
-
Variance
- θ :
-
Half of the included angle of abrasive
- UCT:
-
Undeformed chip thickness
- v :
-
Poisson ratio
- v s :
-
Peripheral velocity of grinding wheel
- v ω :
-
Feed speed
- y cl :
-
Mean line of the assessment length
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Funding
This work was supported by the National Key R&D Program of China (No. 2021YFB3203100) and the National Natural Science Foundation of China (Nos. 51875321 and 52075302).
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Xianpeng Zhang: conceptualization, methodology, validation, formal analysis, investigation, and writing of original draft. Peng Yao: resources, writing including review and editing, funding acquisition, and data curation. Yueming Li: resources and writing including review and editing. Long Jiang: formal analysis and visualization. Xiyong Jin: formal analysis and data sorting. Jimiao Xu: supervision and data curation. Shitong Ling: software and validation. Jiahao Zhu: experiment, data sorting, and validation. Chuanzhen Huang: supervision and project administration. Hongtao Zhu: formal analysis and writing including review & editing. Hanlian Liu: software and data curation.
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Zhang, X., Yao, P., Li, Y. et al. Mechanism analysis and modeling of surface roughness for CeO2 slurry-enhanced grinding BK7 optics. Int J Adv Manuf Technol 131, 2017–2038 (2024). https://doi.org/10.1007/s00170-022-10554-z
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DOI: https://doi.org/10.1007/s00170-022-10554-z