Abstract
To meet the increasing demand for wire electrical discharge machining (WEDM) under extreme conditions such as ultra-high thickness cutting, micro-wire cutting, micro-energy finishing, and ceramic composites machining, a concept of multichannel discharge WEDM under semiconductor characteristics was proposed. The essence of this conception is that under these extreme machining conditions, the electrode wire or workpiece — or even both of the two electrodes — cannot be treated as electrically conductive materials of the conventional WEDM due to their high electrical resistance. However, they can exhibit electrical discharge behavior like semiconductors, which is defined as semiconductor characteristics. The conventional WEDM theory and related technologies cannot be applied to extreme WEDM because conventional WEDM only has one discharge channel per pulse, whereas multiple discharge channels can be generated by each pulse in extreme WEDM. Therefore, a suitable theory needs to be developed for extreme WEDM under semiconductor characteristics. Based on the multichannel discharge behavior of semiconductors, experiments were conducted on high-efficiency machining with multichannel discharge by stacking several workpieces as an assembly with semiconductor characteristics. It was proved that the multichannel discharge WEDM is capable of achieving high machining efficiency, as well as enhanced surface quality and lower wear of electrode wire. The proposed multichannel discharge WEDM sets up the foundation for the establishment of the theoretical system of EDM under semiconductor characteristics.
![](http://media.springernature.com/m312/springer-static/image/art%3A10.1007%2Fs00170-021-07019-0/MediaObjects/170_2021_7019_Fig1_HTML.png)
![](http://media.springernature.com/m312/springer-static/image/art%3A10.1007%2Fs00170-021-07019-0/MediaObjects/170_2021_7019_Fig2_HTML.png)
![](http://media.springernature.com/m312/springer-static/image/art%3A10.1007%2Fs00170-021-07019-0/MediaObjects/170_2021_7019_Fig3_HTML.png)
![](http://media.springernature.com/m312/springer-static/image/art%3A10.1007%2Fs00170-021-07019-0/MediaObjects/170_2021_7019_Fig4_HTML.png)
![](http://media.springernature.com/m312/springer-static/image/art%3A10.1007%2Fs00170-021-07019-0/MediaObjects/170_2021_7019_Fig5_HTML.png)
![](http://media.springernature.com/m312/springer-static/image/art%3A10.1007%2Fs00170-021-07019-0/MediaObjects/170_2021_7019_Fig6_HTML.png)
![](http://media.springernature.com/m312/springer-static/image/art%3A10.1007%2Fs00170-021-07019-0/MediaObjects/170_2021_7019_Fig7_HTML.png)
![](http://media.springernature.com/m312/springer-static/image/art%3A10.1007%2Fs00170-021-07019-0/MediaObjects/170_2021_7019_Fig8_HTML.png)
![](http://media.springernature.com/m312/springer-static/image/art%3A10.1007%2Fs00170-021-07019-0/MediaObjects/170_2021_7019_Fig9_HTML.png)
![](http://media.springernature.com/m312/springer-static/image/art%3A10.1007%2Fs00170-021-07019-0/MediaObjects/170_2021_7019_Fig10_HTML.png)
![](http://media.springernature.com/m312/springer-static/image/art%3A10.1007%2Fs00170-021-07019-0/MediaObjects/170_2021_7019_Fig11_HTML.png)
![](http://media.springernature.com/m312/springer-static/image/art%3A10.1007%2Fs00170-021-07019-0/MediaObjects/170_2021_7019_Fig12_HTML.png)
![](http://media.springernature.com/m312/springer-static/image/art%3A10.1007%2Fs00170-021-07019-0/MediaObjects/170_2021_7019_Fig13_HTML.png)
![](http://media.springernature.com/m312/springer-static/image/art%3A10.1007%2Fs00170-021-07019-0/MediaObjects/170_2021_7019_Fig14_HTML.png)
![](http://media.springernature.com/m312/springer-static/image/art%3A10.1007%2Fs00170-021-07019-0/MediaObjects/170_2021_7019_Fig15_HTML.png)
Similar content being viewed by others
References
Fan YS, Bai JC (2018) Study on volt-ampere characteristics of spark discharge for transistor resistor pulse power of EDM. Int J Adv Manuf Technol 96 (9-12):3019–3031. https://doi.org/10.1007/s00170-018-1702-x
Prakash V, Kumar P, Singh PK, Hussain M, Das AK, Chattopadhyaya S (2019) Micro-electrical discharge machining of difficult-to-machine materials: a review. Proc Inst Mech Eng Part B J Eng Manuf 233(2):339–370. https://doi.org/10.1177/0954405417718591
Kunieda M, Lauwers B, Rajurkar KP, Schumacher BM (2005) Advancing EDM through fundamental insight into the process. CIRP Ann - Manuf Technol 54(2):64–87. https://doi.org/10.1016/s0007-8506(07)60020-1
Wei W, Zhidong L, Wentai S, Yueqin Z, Zongjun T (2016) Surface burning of high-speed reciprocating wire electrical discharge machining under large cutting energy. Int J Adv Manuf Technol 87(9-12):2713–2720. https://doi.org/10.1007/s00170-016-8604-6
Pan H, Liu Z, Li C, Zhang Y, Qiu M (2017) Enhanced debris expelling in high-speed wire electrical discharge machining. Int J Adv Manuf Technol 93(5-8):2913–2920. https://doi.org/10.1007/s00170-017-0716-0
Zhou M, Mu X, He L, Ye Q (2019) Improving EDM performance by adapting gap servo-voltage to machining state. J Manuf Process 37(April 2018):101–113. https://doi.org/10.1016/j.jmapro.2018.11.013
Ho KH, Newman ST (2003) State of the art electrical discharge machining (EDM). Int J Mach Tools Manuf 43(13):1287–1300. https://doi.org/10.1016/S0890-6955(03)00162-7
Deng C, Liu Z, Zhang M, Ji Y, Pan H (2019) Minimizing drum-shaped inaccuracy in high-speed wire electrical discharge machining after multiple cuts. Int J Adv Manuf Technol 102(1-4):241–251. https://doi.org/10.1007/s00170-018-3068-5
Zhang Y, Liu Z, Xia L, Wang W (2016) Interelectrode discharge mechanism in high-speed wire electrical discharge machining. Int J Adv Manuf Technol 84(9-12):2637–2647. https://doi.org/10.1007/s00170-015-7891-7
Chen H, Liu Z, Huang S, Pan H, Qiu M (2015) Study of the mechanism of multi-channel discharge in semiconductor processing by WEDM. Mater Sci Semicond Process 32:125–130. https://doi.org/10.1016/j.mssp.2014.12.061
Kunieda M, Ojima S (2000) Improvement of EDM efficiency of silicon single crystal through ohmic contact. Precis Eng 24(3):185–190. https://doi.org/10.1016/S0141-6359(99)00041-0
Liu Z, Qiu M, Wang W, Tian Z, Huang Y (2011) Research on electrical discharge machining characteristics and mode of providing power of germanium crystal. J Eng Mech 5:177–182. https://doi.org/10.3901/JME.2011.05.177
Liu Z, Chen H, Pan H, Qiu M, Tian Z (2014) Automatic control of WEDM servo for silicon processing using current pulse probability detection. Int J Adv Manuf Technol 76(1-4):367–374. https://doi.org/10.1007/s00170-014-6252-2
Liu L, Qiu M, Shao C, Zhang M, Zhao J (2019) Research on wire-cut electrical discharge machining constant discharge probability pulse power source for silicon crystals. Int J Adv Manuf Technol 100 (5-8):1815–1824. https://doi.org/10.1007/s00170-018-2817-9
He X, Liu Z, Pan H, Qiu M, Zhang Y (2017) Increasing process efficiency of HSWEDM based on discharge probability detection. Int J Adv Manuf Technol 93(9-12):3647–3654. https://doi.org/10.1007/s00170-017-0742-y
Li C, Liu Z, Fang L, Pan H, Qiu M (2018) Super-high-thickness high-speed wire electrical discharge machining. Int J Adv Manuf Technol 95(5-8):1805–1818. https://doi.org/10.1007/s00170-017-1246-5
Li Z, Bai J, Cao Y, Wang Y, Zhu G (2019) Fabrication of microelectrode with large aspect ratio and precision machining of micro-hole array by micro-EDM. J Mater Process Technol 268:70–79. https://doi.org/10.1016/j.jmatprotec.2019.01.009
Singh MA, Joshi K, Hanzel O, Singh RK, Šajgalík P, Marla D (2020) Identification of wire electrical discharge machinability of SiC sintered using rapid hot pressing technique. Ceram Int 46(11):17261–17271. https://doi.org/10.1016/j.ceramint.2020.04.013
Bergs TH, Olivier M, Gommeringer A, Kern F, Klink A (2020) Surface integrity analysis of ceramics machined by wire EDM using different trim cut technologies. Procedia CIRP 87:251–256. https://doi.org/10.1016/j.procir.2020.02.026
Sarkar S, Ghosh K, Mitra S, Bhattacharyya B (2010) An integrated approach to optimization of WEDM combining single-pass and multipass cutting operation. Mater Manuf Process 25(8):799–807. https://doi.org/10.1080/10426910903575848
Antar MT, Soo SL, Aspinwall DK, Sage C, Cuttell M, Perez R, Winn AJ (2012) Fatigue response of Udimet 720 following minimum damage wire electrical discharge machining. Mater Des 42:295–300. https://doi.org/10.1016/j.matdes.2012.06.003
Yan MT, Lai YP (2007) Surface quality improvement of wire-EDM using a fine-finish power supply. Int J Mach Tools Manuf 47(11):1686–1694. https://doi.org/10.1016/j.ijmachtools.2007.01.006
Ho KH, Newman ST, Rahimifard S, Allen RD (2004) State of the art in wire electrical discharge machining (WEDM). Int J Mach Tools Manuf 44(12-13):1247–1259. https://doi.org/10.1016/j.ijmachtools.2004.04.017
Singh MA, Sarma DK, Hanzel O, Sedláček J, Šajgalík P (2017) Machinability analysis of multi walled carbon nanotubes filled alumina composites in wire electrical discharge machining process. J Eur Ceram Soc 37(9):3107–3114. https://doi.org/10.1016/j.jeurceramsoc.2017.03.058
Acknowledgements
The authors extend their sincere thanks to those who contributed in the preparation of the instructions.
Funding
This work was supported by the National Natural Science Foundation of China (grant number 51975290); and the National Key Laboratory of Science and Technology on Helicopter Transmission (Nanjing University of Aeronautics and Astronautics) (grant number HTL-A-20G05).
Author information
Authors and Affiliations
Corresponding author
Ethics declarations
Conflict of interest
The authors declare no competing interests.
Additional information
Author contribution
All authors have been personally and actively involved in substantive work leading to the report.
Materials availability
The data and materials set supporting the results are included within the article.
Publisher’s note
Springer Nature remains neutral with regard to jurisdictional claims in published maps and institutional affiliations.
Rights and permissions
About this article
Cite this article
Pan, H., Liu, Z., Qiu, M. et al. Extreme wire electrical discharge machining based on semiconductor characteristics. Int J Adv Manuf Technol 115, 2477–2489 (2021). https://doi.org/10.1007/s00170-021-07019-0
Received:
Accepted:
Published:
Issue Date:
DOI: https://doi.org/10.1007/s00170-021-07019-0