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Investigation on the thermal behavior of an aerostatic spindle system considering multi-physics coupling effect

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Abstract

The thermal behavior of aerostatic spindles is significantly affected by the multi-physics coupling phenomenon between the air film, the solid structure, and the temperature field of the spindle system. In this study, a novel simulation modeling method is proposed to investigate the multi-physics coupling phenomenon of the aerostatic spindle system, by which the elastic deformation and the thermal deformation of solid parts can be considered simultaneously to predict the thermal behavior of the aerostatic spindle. Besides, the variation in the performance of air bearing and the gravitational eccentricity of the shaft during the temperature rise process are also obtained, which provides an insight into the multi-physics coupling phenomenon of the aerostatic spindle. Finally, the temperature raise process of the aerostatic spindle system is measured to validate the proposed model.

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Funding

The authors deeply acknowledge the financial support from the National Science and Technology Program: Research and Development of High Stiffness Nano-drive Systems of Ultra-precision Machine Tools (2015DFA70630) and the Doctoral Student Short-Term Visiting Research Project of Harbin Institute of Technology.

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Authors and Affiliations

  1. School of Mechatronics Engineering, Harbin Institute of Technology, P.O. Box 413, 92 West Dazhi Street, Nan Gang District, Harbin, 150001, China

    Qiang Gao, Lihua Lu, Rui Zhang, Laiyun Song & Guanglin Wang

  2. School of Engineering, Newcastle University, Newcastle upon Tyne, NE1 7RU, UK

    Qiang Gao & Dehong Huo

Authors
  1. Qiang Gao
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  2. Lihua Lu
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  3. Rui Zhang
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  4. Laiyun Song
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  5. Dehong Huo
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  6. Guanglin Wang
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Correspondence to Lihua Lu.

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Gao, Q., Lu, L., Zhang, R. et al. Investigation on the thermal behavior of an aerostatic spindle system considering multi-physics coupling effect. Int J Adv Manuf Technol 102, 3813–3823 (2019). https://doi.org/10.1007/s00170-019-03509-4

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  • DOI: https://doi.org/10.1007/s00170-019-03509-4

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