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An analytical investigation of pad wear caused by the conditioner in fixed abrasive chemical–mechanical polishing

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Abstract

Fixed abrasive chemical–mechanical polishing (CMP) is an efficient surface finishing method. The non-uniformity of substrates after polishing is one of the most interesting things in current trends in research. One of the reasons for the non-uniformity is pad wear. The pad in this polishing process has abrasive grains embedded on the surface. Researching on the pad wear will help improve the pad conditioning process to get a better pad surface. Some studies have used kinematic motion to show the correlation between the cutting path density and the pad wear. However, the effect of contact time between the conditioner’s grains and the pad surface on the pad wear non-uniformity has not been integrated yet. In this research, an analytical model was established by combining of the kinematic motions and the contact time to investigate the pad wear non-uniformity. The results indicated that the cutting path density and the contact time near the pad center are more than that near the pad edge. They could be the main reasons of the non-uniformity of the pad wear. The model results showed a good agreement with experiments.

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References

  1. Kim HJ (2013) Tribological approaches to material removal rate during chemical mechanical polishing. Met Mater Int 19(2):335

    Article  Google Scholar 

  2. Enomoto T, Satake U, Fujita T, Sugihara T (2013) Spiral-structured fixed-abrasive pads for glass finishing. CIRP Ann Manuf Technol 62(1):311–314. doi:10.1016/j.cirp.2013.03.011

    Article  Google Scholar 

  3. van der Velden P (2000) Chemical mechanical polishing with fixed abrasives using different subpads to optimize wafer uniformity. Microelectron Eng 50(1–4):41–46

    Article  Google Scholar 

  4. Zhong ZW, Tian YB, Ng JH, Ang YJ (2013) Chemical mechanical polishing (CMP) processes for manufacturing optical silicon substrates with shortened polishing time. Mater Manuf Process 29(1):15–19

    Article  Google Scholar 

  5. Tian YB, Zhong ZW, Lai S, Ang Y (2013) Development of fixed abrasive chemical mechanical polishing process for glass disk substrates. Int J Adv Manuf Technol 68(5–8):993–1000

    Article  Google Scholar 

  6. Tian YB, Zhong ZW, Ng JH (2013) Effects of chemical slurries on fixed abrasive chemical–mechanical polishing of optical silicon substrates. Int J Precis Eng Manuf 14(8):1447–1454

    Article  Google Scholar 

  7. Tian YB, Ang YJ, Zhong ZW, Xu H, Tan R (2013) Chemical mechanical polishing of glass disk substrates: preliminary experimental investigation. Mater Manuf Process 28(4):488–494

    Article  Google Scholar 

  8. Zhong ZW, Tian YB, Ang Y, Wu H (2012) Optimization of the chemical mechanical polishing process for optical silicon substrates. Int J Adv Manuf Technol 60(9–12):1197–1206

    Article  Google Scholar 

  9. Liao XY, Zhuang Y, Borucki LJ, Cheng J, Theng S, Ashizawa T, Philipossian A (2013) Effect of pad surface micro-texture on removal rate during interlayer dielectric chemical mechanical planarization process. Japanese Journal of Applied Physics 52 (1). doi:10.7567/jjap.52.018001

  10. Lee S, Jeong S, Park K, Kim H, Jeong H (2009) Kinematical modeling of pad profile variation during conditioning in chemical mechanical polishing. Jpn J Appl Phys 48(12):126502–126505

    Article  Google Scholar 

  11. Baisie E, Li ZC, Zhang XH (2013) Design optimization of diamond disk pad conditioners. Int J Adv Manuf Technol 66(9–12):2041–2052

    Article  Google Scholar 

  12. Tso P-L, Ho S-Y (2007) Factors influencing the dressing rate of chemical mechanical polishing pad conditioning. Int J Adv Manuf Technol 33(7–8):720–724

    Article  Google Scholar 

  13. Achuthan K, Curry J, Lacy M, Campbell D, Babu S (1996) Investigation of pad deformation and conditioning during the CMP of silicon dioxide films. J Electron Mater 25(10):1628–1632

    Article  Google Scholar 

  14. Kim H, Kim H, Jeong H, Seo H, Lee S (2003) Self-conditioning of encapsulated abrasive pad in chemical mechanical polishing. J Mater Process Technol 142(3):614–618. doi:10.1016/S0924-0136(03)00641-1

    Article  Google Scholar 

  15. Chang O, Kim H, Park K, Park B, Seo H, Jeong H (2007) Mathematical modeling of CMP conditioning process. Microelectron Eng 84(4):577–583

    Article  Google Scholar 

  16. Y-y Z, Davis EC (1999) Variation of polish pad shape during pad dressing. Mater Sci Eng B 68(2):91–98. doi:10.1016/S0921-5107(99)00423-7

    Article  Google Scholar 

  17. Hooper B, Byrne G, Galligan S (2002) Pad conditioning in chemical mechanical polishing. J Mater Process Technol 123(1):107–113

    Article  Google Scholar 

  18. Zhao D, Wang T, He Y, Lu X (2013) Kinematic optimization for chemical mechanical polishing based on statistical analysis of particle trajectories. IEEE Trans Semicond Manuf 26(4):556–563

    Article  Google Scholar 

  19. Feng T (2007) Pad conditioning density distribution in CMP process with diamond dresser. IEEE Trans Semicond Manuf 20(4):464–475

    Article  Google Scholar 

  20. Li Z, Baisie EA, Zhang X (2012) Diamond disc pad conditioning in chemical mechanical planarization (CMP): a surface element method to predict pad surface shape. Precis Eng 36(2):356–363

    Article  Google Scholar 

  21. Yeh H-M, Chen K-S (2010) Development of a pad conditioning simulation module with a diamond dresser for CMP applications. Int J Adv Manuf Technol 50(1–4):1–12

    Article  Google Scholar 

  22. Baisie EA, Li Z, Zhang X (2013) Pad conditioning in chemical mechanical polishing: a conditioning density distribution model to predict pad surface shape. Int J Manuf Res 8(1):103–119

    Article  Google Scholar 

  23. Zhao D, He Y, Wang T, Lu X (2012) Effect of kinematic parameters and their coupling relationships on global uniformity of chemical–mechanical polishing. IEEE Trans Semicond Manuf 25(3):502–510

    Article  Google Scholar 

  24. Feng T (2007) Nonuniformity of wafer and pad in CMP: kinematic aspects of view. IEEE Trans Semicond Manuf 20(4):451–463

    Article  Google Scholar 

  25. Kim H, Jeong H (2004) Effect of process conditions on uniformity of velocity and wear distance of pad and wafer during chemical mechanical planarization. J Electron Mater 33(1):53–60. doi:10.1007/s11664-004-0294-4

    Article  Google Scholar 

  26. Hocheng H, Tsai H, Tsai M (2000) Effects of kinematic variables on nonuniformity in chemical mechanical planarization. Int J Mach Tools Manuf 40(11):1651–1669

    Article  Google Scholar 

  27. Zhou LB, Shimizu J, Shinohara K, Eda H (2003) Three-dimensional kinematical analyses for surface grinding of large scale substrate. Precis Eng J Int Soc Precis Eng Nanotechnol 27(2):175–184. doi:10.1016/s0141-6359(02)00225-8

    Google Scholar 

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Authors and Affiliations

  1. School of Mechanical and Aerospace Engineering, Nanyang Technological University, 50 Nanyang Avenue, 639798, Singapore, Singapore

    N. Y. Nguyen & Z. W. Zhong

  2. Singapore Institute of Manufacturing Technology, 71 Nanyang Drive, 638075, Singapore, Singapore

    Yebing Tian

Authors
  1. N. Y. Nguyen
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  2. Z. W. Zhong
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  3. Yebing Tian
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Correspondence to Z. W. Zhong or Yebing Tian.

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Nguyen, N.Y., Zhong, Z.W. & Tian, Y. An analytical investigation of pad wear caused by the conditioner in fixed abrasive chemical–mechanical polishing. Int J Adv Manuf Technol 77, 897–905 (2015). https://doi.org/10.1007/s00170-014-6490-3

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  • DOI: https://doi.org/10.1007/s00170-014-6490-3

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