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Microstructural, mechanical, and thermophysical characterization of Cu/WC composite layers fabricated via friction stir processing

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Abstract

The fabrication of Cu/WC composites by applying the 1-, 2-, and 4-pass friction stir processing was the main aim of present investigation. The results indicated that the composites fabricated by this method had a good quality. Increasing the pass numbers was also used to improve the dispersion of WC particles and consequently to intensify the mechanical properties of composite layers. The microstructural, mechanical, and thermophysical properties of the composites were used to confirm this claim. The grain size in these composites shows the promising reduction to the 1.2 μm in 4-pass friction stir processed one, and microhardness values reach to a considerable amount up to two times more than the pure copper. Wear rate and friction coefficient evaluation of the composites in different sliding rates demonstrated the composites resistance against weight loss and high reliability of the 4-pass friction stir processed composites in higher wear distances compared to that of fabricated by 1-pass. Moreover, the thermal expansions of the composites were examined up to 500 °C which is indicative of the composites stability in higher temperatures.

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Authors and Affiliations

  1. Department of Mechanical Engineering, Iran University of Industries and Mines, Tehran, Iran

    Jahangir Khosravi & Abbas Rahi

  2. School of Mechanical Engineering, College of Engineering, University of Tehran, P.O. Box 11155-4563, Tehran, Iran

    Mohammad Kazem Beshrati Givi & Mohsen Barmouz

Authors
  1. Jahangir Khosravi
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  2. Mohammad Kazem Beshrati Givi
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  3. Mohsen Barmouz
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  4. Abbas Rahi
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Corresponding author

Correspondence to Mohsen Barmouz.

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Khosravi, J., Givi, M.K.B., Barmouz, M. et al. Microstructural, mechanical, and thermophysical characterization of Cu/WC composite layers fabricated via friction stir processing. Int J Adv Manuf Technol 74, 1087–1096 (2014). https://doi.org/10.1007/s00170-014-6050-x

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  • DOI: https://doi.org/10.1007/s00170-014-6050-x

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