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Numerical simulation on the local stress and local deformation in multi-point stretch forming process

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Abstract

Multi-point stretch forming (MPSF) is a new flexible forming technique to form aircraft outer skin parts. The multi-point stretching die (MPSD) replaces the traditional fixed shape stretching die, and the sheet metal is formed over a MPSD composed by the punch element. The MPSD is a discontinuous surface of discrete stretching die, and the stress concentration and local strain occur on formed parts. These lead to generate dimples on the surface of formed part. In this paper, a series of numerical simulations on MPSF processes for stretching parabolic cylindrical, spherical, and saddle-shaped parts were carried out. The local stress and local strain in thickness distribution of MPSF part were analyzed by dispersed the blank into solid elements. The forming results of MPSF were compared with those that use traditional stretch forming, and the influences of thickness of elastic cushion and the size of punch element on the stress concentration and local strain were surveyed. The simulation results show the distribution of local stress and local deformation in different layers, and the elastic cushion and the small size of punch element can reduce the stress concentration and local deformation. The results may understand the stress distribution on the sheet and prevent the defect of dimple.

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Acknowledgments

This work was supported by the National Science Foundation (50775098 and 51075186) and the “985 Project” of Jilin University of China.

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Authors and Affiliations

  1. Roll Forging Research Institute, Jilin University (Nanling Campus), No. 5988 Renmin Street, Changchun, 130025, People’s Republic of China

    Shaohui Wang, Zhongyi Cai, Mingzhe Li & Yingwu Lan

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  1. Shaohui Wang
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  2. Zhongyi Cai
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  3. Mingzhe Li
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  4. Yingwu Lan
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Correspondence to Zhongyi Cai.

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Wang, S., Cai, Z., Li, M. et al. Numerical simulation on the local stress and local deformation in multi-point stretch forming process. Int J Adv Manuf Technol 60, 901–911 (2012). https://doi.org/10.1007/s00170-011-3663-1

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  • DOI: https://doi.org/10.1007/s00170-011-3663-1

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