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Subsurface crystal lattice deformation machined by ultraprecision grinding of soft-brittle CdZnTe crystals

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Abstract

Cd0.96Zn0.04Te (111) single crystals were ultraprecisely ground by #1500, #3000, and #5000 diamond grinding wheels, and the corresponding surface roughness Ra is 49.132, 18.746, and 5.762 nm. High-resolution field emission scanning electron microscope and transmission electron microscope were employed to investigate the surface and subsurface damage. After ultraprecision grinding by three kinds of diamond wheels, the subsurface can achieve ultra-low damage layer with thickness of 1–2 nm made of amorphous state material and lattice distortion layer. For the #1500 precision grinding, the subsurface damage is mainly multi-nanocrystal with diameter in the range of 5–20 nm. While for the #3000 precision grinding, the subsurface damage is made of amorphous state material containing nanocrystals with diameter mainly in the range of 2–5 nm, and the bending deformation is mainly conducted through dislocation pleat formation. For #5000 ultraprecision grinding, the subsurface damage is mainly amorphous state material, and nanocrystals with diameter in the range of 2–5 nm enrich adjacent to the ground surface. Moreover, the size of nanocrystal ground by #5000 diamond grinding wheel is mainly 2 nm. Fracture mechanism ground by #5000 diamond grinding wheel firstly turns onto thin amorphous state film, then fracture.

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Authors and Affiliations

  1. Key Laboratory for Precision and Non-Traditional Machining Technology of Ministry of Education, Dalian University of Technology, Dalian, 116024, People’s Republic of China

    Zhenyu Zhang, Dongming Guo, Renke Kang, Hang Gao, Zhuji Jin & Yaowu Meng

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  1. Zhenyu Zhang
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  2. Dongming Guo
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  3. Renke Kang
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  4. Hang Gao
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  5. Zhuji Jin
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  6. Yaowu Meng
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Correspondence to Zhenyu Zhang.

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Zhang, Z., Guo, D., Kang, R. et al. Subsurface crystal lattice deformation machined by ultraprecision grinding of soft-brittle CdZnTe crystals. Int J Adv Manuf Technol 47, 1065–1081 (2010). https://doi.org/10.1007/s00170-009-2253-y

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  • DOI: https://doi.org/10.1007/s00170-009-2253-y

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