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Research on AOCTPN-based modeling and simulation technology of semiconductor fabrication line

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Abstract

There was a lack of modeling technology for the line fabrication of semiconductors under multi-agent-based scheduling and control status in quo. To resolve this problem, an AOCTPN modeling technology for a semiconductor fabrication line was proposed. The interior behavior of the machine agent was encapsulated and the hierarchical multi-agent-based semiconductor fabrication line model was separated into the system layer, the machine group layer, and the machine agent layer, which reduced the complexity and improved the reuse of the model. In addition, a distributed discrete event simulation platform was built to evaluate the performance of the multi-agent-based semiconductor fabrication line. An illustrative example of a 6-inch semiconductor fabrication line in Shanghai demonstrates the effectiveness of this approach .

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Authors and Affiliations

  1. Institute of Computer Integrated Manufacturing, School of Mechanical and Power Engineering, Shanghai Jiao Tong University, Shanghai, 200030, P.R. China

    Zhai Wenbin, Chu Xuening, Zhang Jie, Ma Dengzhe, Jin Ye & Yan Juanqi

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  1. Zhai Wenbin
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  2. Chu Xuening
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  3. Zhang Jie
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  4. Ma Dengzhe
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  5. Jin Ye
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  6. Yan Juanqi
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Correspondence to Zhai Wenbin.

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Wenbin, Z., Xuening, C., Jie, Z. et al. Research on AOCTPN-based modeling and simulation technology of semiconductor fabrication line. Int J Adv Manuf Technol 28, 814–821 (2006). https://doi.org/10.1007/s00170-004-2409-8

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  • DOI: https://doi.org/10.1007/s00170-004-2409-8

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