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Particleboard I.B. forcast by TMA bending in UF adhesives curing

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References

  • Garcia R, Pizzi A (1998) Cross-linked and entanglement networks in thermomechanical analysis of polycondensation resins, J. Appl. Polymer Sci., in press

  • Kamoun C, Pizzi A, Garcia R (1998) The effect of humidity on cross-linked and entanglement networking of formaldehyde-based wood adhesives, Holz Roh Werkstoff, in press

  • Pizzi A (1997) On the correlation of some theoretical and experimental results in polycondensation resins networking, J. Appl. Polymer Sci., 63: 603–614

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  1. ENSTIB, University of Nancy 1, F-88051, Epinal Cedex 9, France

    Y. Laigle, C. Kamoun & A. Pizzi

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  1. Y. Laigle
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  2. C. Kamoun
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  3. A. Pizzi
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Laigle, Y., Kamoun, C. & Pizzi, A. Particleboard I.B. forcast by TMA bending in UF adhesives curing. Holz als Roh-und Werkstoff 56, 154 (1998). https://doi.org/10.1007/s001070050288

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