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Epoxy moulding system for the encapsulation of microelectronic devices suitable for implantation

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References

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Authors and Affiliations

  1. Bio-Engineering Institute, University of New Brunswick, PO Box 4400, E3B 5A3, Fredericton, New Brunswick, Canada

    D. F. Lovely, M. B. Olive & R. N. Scott

Authors
  1. D. F. Lovely
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  2. M. B. Olive
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  3. R. N. Scott
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Lovely, D.F., Olive, M.B. & Scott, R.N. Epoxy moulding system for the encapsulation of microelectronic devices suitable for implantation. Med. Biol. Eng. Comput. 24, 206–208 (1986). https://doi.org/10.1007/BF02443939

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  • DOI: https://doi.org/10.1007/BF02443939

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