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Fixed abrasive polishing: the effect of particle size on the workpiece roughness and sub-surface damage

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Abstract

Due to the random and unpredictable shortcomings of traditional polishing, we have carried out research on the fixed abrasive polishing in anhydrous environment. In the fixed abrasive polishing, the particle size is one of the main reasons that affect the quality of the processing. The purpose of this paper is to grasp the deterministic polishing technology, and experiments were conducted to explore the effect of particle size on the workpiece roughness and sub-surface damage (SSD). The results show that there is a nonlinear relationship between roughness and particle size, which may be the result of mechanical and chemical effects in the polishing process. Also, due to the mechanical removal, the SSD still exists and origins with the larger particles in the tail of particle size distribution. Through the experiment and research, we can get the best processing conditions that ceria wheel with a particle size of 100 nm can polish the fused silica with a roughness of 1.98 nm, and the SSD depth is only 80 nm.

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Data availability

The data that support the findings of this study are available from the corresponding authors upon reasonable request.

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Funding

This work was supported by the National Natural Science Foundation of China (No. 52075462).

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Authors and Affiliations

  1. Department of Mechanical and Electrical Engineering, Xiamen University, Xiamen 361005, China

    Xinyu Luo, Wei Yang & Yuan Qian

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  1. Xinyu Luo
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  2. Wei Yang
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  3. Yuan Qian
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Contributions

Xinyu Luo and Wei Yang constructed the theoretical model. Wei Yang designed the experiment. Measurements were performed by Xinyu Luo and Yuan Qian. Xinyu Luo, Wei Yang, and Yuan Qian analyzed the data and contributed to writing the manuscript.

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Correspondence to Wei Yang.

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Luo, X., Yang, W. & Qian, Y. Fixed abrasive polishing: the effect of particle size on the workpiece roughness and sub-surface damage. Int J Adv Manuf Technol 115, 3021–3035 (2021). https://doi.org/10.1007/s00170-021-07363-1

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  • DOI: https://doi.org/10.1007/s00170-021-07363-1

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