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Application of polymer in encapsulation of electronic parts

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Electronic Applications

Part of the book series: Advances in Polymer Science ((POLYMER,volume 84))

Abstract

The rapid development of integrated circuit (IC) technology from small-scale integration (SSI) to very large-scale integration (VLSI) has had great technological and economic impact on the electronic industry. The exponential growth of the number of components per IC chip, and the exponential decrease of device dimensions and the steady increase in IC chip size have imposed stringent requirements, not only on the IC physical design and fabrication, but also on the IC encapsulants. This chapter reviews the VLSI technology trends and their economic impact on the electronic industry. The purpose of encapsulation, encapsulation techniques and a general overview of the application of inorganic and organic polymer materials as electronic device encapsulants will also be addressed.

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Authors and Affiliations

  1. AT & T Engineering Research Center, P.O. Box 900, 08540, Princeton, NJ, USA

    C. P. Wong

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© 1988 Springer-Verlag

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Wong, C.P. (1988). Application of polymer in encapsulation of electronic parts. In: Electronic Applications. Advances in Polymer Science, vol 84. Springer, Berlin, Heidelberg. https://doi.org/10.1007/BFb0025903

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  • DOI: https://doi.org/10.1007/BFb0025903

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  • Publisher Name: Springer, Berlin, Heidelberg

  • Print ISBN: 978-3-540-18133-0

  • Online ISBN: 978-3-540-47784-6

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