Abstract
Superhydrophobic aluminum surfaces have been prepared by means of electrodeposition of copper on aluminum surfaces, followed by electrochemical modification using stearic acid organic molecules. Scanning electron microscopy (SEM) images show that the electrodeposited copper films follow “island growth mode” in the form of microdots and their number densities increase with the rise of the negative deposition potentials. At an electrodeposition potential of −0.2 V the number density of the copper microdots are found to be 4.5×104 cm−2 that are increased to 2.9×105 cm−2 at a potential of −0.8 V. Systematically, the distances between the microdots are found to be reduced from 26.6 μm to 11.03 μm with the increase of negative electrochemical potential from −0.2V to −0.8V. X-ray diffraction (XRD) analyses have confirmed the formation of copper stearate on the stearic acid modified copper films. The roughness of the stearic acid modified electrodeposited copper films is found to increase with the increase in the density of the copper microdots. A critical copper deposition potential of −0.6V in conjunction with the stearic acid modification provides a surface roughness of 6.2 μm with a water contact angle of 157°, resulting in superhydrophobic properties on the aluminum substrates.
Article PDF
Similar content being viewed by others
Avoid common mistakes on your manuscript.
References
T. L. Sun, L. Feng, X. F. Gao and L. Jiang, Accounts Chem. Res. 38, 644 (2005). http://dx.doi.org/10.1021/ar040224c
W. Barthlott and C. Neinhuis, Planta 202, 1 (1997). http://dx.doi.org/10.1007/s004250050096
X. Gao and L. Jiang, Nature 432, 36 (2004). http://dx.doi.org/10.1038/432036a
Y. Zheng, X. Gao and L. Jiang, Soft Matter 3, 178 (2007). http://dx.doi.org/10.1039/b612667g
J. Huang, X. Wang and Z. L. Wang, Nano Lett. 6, 2325 (2006). http://dx.doi.org/10.1021/nl061851t
D. K. Sarkar and N. Saleema, Surf. Coat. Tech. 204, 2483 (2010). http://dx.doi.org/10.1016/j.surfcoat.2010.01.033
A. Scardino, R. D. Nys, O. Ison, W. O’Connor and P. Steinberg, Biofouling 19, 221 (2003). http://dx.doi.org/10.1080/0892701021000057882
A. Singh, L. Steely and H. R. Allcock, Polym. Prepr. (ACS, Div. Polym.Chem.) 46, 599 (2005).
H. Gau, S. Herminghaus, P. Lenz and R. Lipowsky, Science 46, 283 (1996).
T. Liu, Y. Yin, S. Chen, X. Chang and S. Cheng, Electrochimica Acta 52, 3709 (2007). http://dx.doi.org/10.1016/j.electacta.2006.10.059
K. Satoh and H. Nakazumi, J. Sol-Gel Sci. Tech. 27, 327 (2003). http://dx.doi.org/10.1023/A:1024025104733
D. K. Sarkar and M. Farzaneh, J. Adhes. Sci. Technol. 23, 1215 (2009). http://dx.doi.org/10.1163/156856109X433964
D. K. Sarkar, M. Farzaneh and R. W. Paynter, Mater. Lett. 62, 1226 (2008). http://dx.doi.org/10.1016/j.matlet.2007.08.051
A. Safaee, D. K. Sarkar and M. Farzaneh, Appl. Surf. Sci. 254, 2493 (2008). http://dx.doi.org/10.1016/j.apsusc.2007.09.073
D. K. Sarkar, M. Farzaneh and R. W. Paynter, Appl. Surf. Sci. 256, 3698 (2010). http://dx.doi.org/10.1016/j.apsusc.2009.12.049
N. Saleema, D. K. Sarkar, Farzaneh M. In: Mittal KL, editor. Contact angle, wettability and adhesion, vol. 5. Leiden: VSP/Brill; 2008. p. 279.
D. K. Sarkar and M. Farzaneh In: Mittal KL, editor. Contact angle, wettability and adhesion, vol. 5. Leiden: VSP/Brill; 2008. p. 271.
Y. Huang, D. K. Sarkar and X. Grant, Chen, Mater. Lett. 64, 2722 (2010). http://dx.doi.org/10.1016/j.matlet.2010.09.010
N. Saleema, D. K. Sarkar, R. W. Paynter and X. G. Chen, ACS Appl. Mater. Interface. (Letters) 2, 2500 (2010). http://dx.doi.org/10.1021/am100563u
D. K. Sarkar and R. W. Paynter, J. Adhesion Sci. Technol. 24, 1181 (2010). http://dx.doi.org/10.1163/016942409X12598231568546
D. K. Sarkar and N. Saleema, Surf. Coat. Technol. 204, 2483 (2010). http://dx.doi.org/10.1016/j.surfcoat.2010.01.033
D. K. Sarkar, X. J. Zhou, A. Tannous and K. T. Leung, J. Phys. Chem. B (Letters) 107, 2879 (2003). http://dx.doi.org/10.1021/jp0269524
M. Volmer and A. Z. Weber, Phys. Chem. 119, 277 (1926).
M. R. Khelladi, L. Mentar, A. Azizi, A. Sahari and A. Kahoul, Mater. Chem. Phys. 115, 385 (2009). http://dx.doi.org/10.1016/j.matchemphys.2008.12.017
JCPDS Al (01-085-1327.
JCPDS Cu (01-085-1326).
S. K. Rawal, A. K. Chawla, V. Chawla, R. Jayaganthan and R. Chandra, Mater. Sci. Eng. B 172, 259 (2010). http://dx.doi.org/10.1016/j.mseb.2010.05.027
Author information
Authors and Affiliations
Corresponding author
Rights and permissions
Open Access This article is licensed under a Creative Commons Attribution 4.0 International License, which permits use, sharing, adaptation, distribution and reproduction in any medium or format, as long as you give appropriate credit to the original author(s) and the source, provide a link to the Creative Commons licence, and indicate if changes were made.
The images or other third party material in this article are included in the article’s Creative Commons licence, unless indicated otherwise in a credit line to the material. If material is not included in the article’s Creative Commons licence and your intended use is not permitted by statutory regulation or exceeds the permitted use, you will need to obtain permission directly from the copyright holder.
To view a copy of this licence, visit https://creativecommons.org/licenses/by/4.0/.
About this article
Cite this article
Huang, Y., Sarkar, D.K. & Chen, XG. Fabrication of Superhydrophobic Surfaces on Aluminum Alloy Via Electrodeposition of Copper Followed by Electrochemical Modification. Nano-Micro Lett. 3, 160–165 (2011). https://doi.org/10.1007/BF03353667
Received:
Accepted:
Published:
Issue Date:
DOI: https://doi.org/10.1007/BF03353667