Abstract
The out-of-plane thermal expansion coefficient α⊥ of biphenyldianhydride-phenylenediamine (BPDA-PDA) polyimide thin film between 20 and 400°C has been measured using a laser spot scanning interferometer. The α⊥ varies from 100 ppm/°C at 20°C to 400 ppm/°C at 400°C. As the result of highly anisotropic microstructure, the α⊥ is much larger than the in-plane thermal expansion coefficient α∥ and increases dramatically when the temperature exceeds the glass transition temperature (≈320°C).
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Chen, S.T., Wagner, H.H. Out-of-plane thermal expansion coefficient of biphenyldianhydride-phenylenediamine polyimide film. J. Electron. Mater. 22, 797–799 (1993). https://doi.org/10.1007/BF02817357
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DOI: https://doi.org/10.1007/BF02817357