Dense, denser, densest ...

Abstract

These words net out the driving forces, the evolutionary thrusts and the assorted limitations of the microelectronics technology—the semiconductor chips and their packaging. Current status of the technology is near the middle of the S-shaped learning curve, with the attendant highest rate of progress. This paper highlights the driving forces (e.g. cost, performance), the limiting parameters (e.g. dimensions, tolerances, power densities) and the major parametric interdependencies. Major historical trends and their extrapolations quantify key variables.