Abstract
The settling of suspended metal and sulfide droplets in liquid metallurgical, slags can be affected by electric fields. The migration of droplets due to electrocapillary motion phenomena may be used to enhance the recovery of suspended matte/metal droplets and thereby to increase the recovery of pay metals. An experimental technique was developed for the purpose of measuring the effect of electric fields on the settling rate of metallic drops in liquid slags. Copper drops suspended in CaO−SiO2−Al2O3−Cu2O slags were found to migrate toward the cathode. Electric fields can increase the settling rate of 5-mm-diameter copper drops 3 times or decrease the settling until levitation by reversal of the electric field. The enhanced settling due to electric fields decreases with increasing Cu2O contents in the slag.
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Warczok, A., Utigard, T.A. Settling of copper drops in molten slags. Metall Mater Trans B 26, 1165–1173 (1995). https://doi.org/10.1007/BF02654001
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DOI: https://doi.org/10.1007/BF02654001