Abstract
Thermal response of electrodeposited copper has been characterized by monitoring changes in microstructure, tensile strength, elongation, and microhardness following 30 minute isothermal anneal at temperatures between 23 and 450°C. By judicious control of additives to the electrolyte, considerable enhancements of strength, hardness, and anneal resistance are obtained. When recrystallization is shifted to higher temperatures, annealing proceeds by recovery-like processes; prior to the onset of recrystallization, significant strength loss may occur by recovery. Recrystallization initiates near the substrate side of the deposit and progresses along an uneven front across the deposit thickness. The microhardness and tensile response monitors indicate several unusual anneal-related microstructural processes: (i) precipitation (of microvoids) hardening, (ii) dissolution and reprecipitation, (iii) stepped progress of recovery and recrystallization, and (iv) embrittlement (loss of elongation) at low anneal temperatures and prior to the onset of recrystallization.
This is a preview of subscription content, log in via an institution to check access.
Similar content being viewed by others
References
H.D. Merchant,J. Electron. Mater. 22, 631 (1993).
J.B. Cohen, A. Nelson and R.J. DeAngelis,Trans. AIME 236, 133 (1966).
P. Gordon,Trans. AIME 203, 1043 (1955).
R. Weil, H.J. Sumka and G.W. Greene,J. Electroch. Soc. 114, 449 (1967).
A. Gangulee,J. Appl. Phys. 45, 3749 (1974).
A.A. Vikarchuk,Soviet Electroch. 28, 805 (1992).
C. Schmidt,Galvanotechnik 82, 3800 (1991).
A.A. Vikarchuk,Soviet Electroch. 26, 883 (1990).
Y.D. Gamburg et al.,Soviet Electroch. 10, 278 (1974).
Y.M. Polukarov and Z.V. Semenova,Soviet Electroch. 12, 1059 (1976).
N. Hansen and B. Ralph,Acta Metall. 30, 411 (1982).
N.A. Smirnova et al.,Phys. Met. Metall. 61, 1170 (1986); 62, 140(1986).
S. Murphy and C.J. Bell,J. Ist. Met. 100, 225 (1972).
S. Nakahara,Thin Solid Films 45, 421 (1977).
C Szeles and A.Vertes,J.Phys.F:Met.Phys. 17,2031(1987).
V.V. Gubin et al.,Soviet Electroch. 20, 671 (1984).
K. Farrel and J.T. Houston,Metall. Trans. 1, 1979 (1970).
G.W. Greenwood and A. Boltax,J. Nucl. Mat. 5, 234 (1964).
R. Kelly,Phys. Stat. Sol. 21, 451 (1967).
Y.M. Polukarov, Y.D. Gamburg and V.I. Karateeva,Soviet Electroch. 18, 1387 (1982).
Y.M. Polukarov and Y.D. Gamburg,Soviet Electroch. 7, 693 (1971).
I.M. Kovenskii, V.V. Povetkin and N.I. Matveev,Russ. Met. (2), 51 (1990).
Y.N. Petrov, E.A. Mamontov and V.M. Kozlov,Phys. Met. Metall. 22 (5) 69 (1966).
V.P. Burkeev et al.,Soviet J. Non-Ferrous Mets. 23 (1) 88 (1982).
T.C. Franklin,Surf. Coating Tech. 30, 415 (1987);Plating Surf. Fin. 81, 62 (Apr. 1994).
J. Oniciu and L. Muresan,J. Appl. Electroch. 21, 565 (1991).
J.K. Dennis,Electroplating Met. Fin. 21, 16 (Jan. 1968).
L. Fairman,Met. Fin. 68, 45 (July 1970).
S. Mizumoto et al.Hyomen Gijutsu 44, 687 (1993).
G.T. Higgins,Metall. Trans. 2, 1277 (1971).
F.N. Rhines and P.J. Wray,Trans. Am. Soc. Met. 54, 117 (1961).
G.D. Hughes et al.,Scripta Metall. 20, 93 (1986).
M.L. Khazin,J. Appl. Chem. USSR 59, 52 (1986).
Author information
Authors and Affiliations
Rights and permissions
About this article
Cite this article
Merchant, H.D. Thermal response of electrodeposited copper. J. Electron. Mater. 24, 919–925 (1995). https://doi.org/10.1007/BF02652962
Received:
Revised:
Issue Date:
DOI: https://doi.org/10.1007/BF02652962