Abstract
The choice of the bottom electrode or barrier layer plays an important role in determining the electrical and structural properties of metal/ferroelectric/metal thin film capacitors. A substantial improvement of the electrical and structural properties of the capacitors was found by using RuO2 as a bottom electrode. Electrical measurement on a capacitor with a structure of BaTiO3(246 nm)/RuO2 (200 nm)/SiO2/Si, where the BaTiO3 thin film was deposited at room temperature, showed a dielectric constant of around 15, leakage current density of 1.6 × 10−7A/cm2 at 4 V, a dc conductivity of 9.8 × 1014S/cm, and a capacitance per unit area of 5.6 × 104pF/cm2. A similar structure but with polycrystalline BaTiO3 (273 nm) as the dielectric deposited at 680°C showed a dielectric constant of 290, leakage current density of 1.7 × 10−3A/cm2 at 4 V, a dc conductivity of 1.2 × 10−8 S/cm, and a capacitance per unit area of 9.4 × 105 pF/cm2. Scanning electron microscopy analysis on the films showed differences in the microstructure due to the use of different bottom electrode materials, such as RuO2 or Pd.
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Jia, Q.X., Shi, Z.Q., Yi, J. et al. Effect of barrier layers on BaTiO3 thin film capacitors on Si substrates. J. Electron. Mater. 23, 53–56 (1994). https://doi.org/10.1007/BF02651267
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DOI: https://doi.org/10.1007/BF02651267