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Elevated-temperature fatigue crack growth Behavior of MAR-M200 Single Crystals

  • Mechanical Behavior
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Abstract

The fatigue crack growth behavior of MAR-M200 single crystals was examined at 982 °C. Using tubular specimens, fatigue crack growth rates were determined as functions of crystallographic orientation and the stress state by varying the applied shear stress range-to-normal stress range ratio. Neither crystallographic orientation nor stress state was found to have a significant effect on crack growth rate when correlated with an effective ΔK which accounted for mixed-mode loading and elastic anisotropy. For both uniaxial and multiaxial fatigue, crack growth generally occurred normal to the principal stress direction and in a direction along which ΔK II vanished. Consequently, the effective ΔK was reduced to ΔKI and the rate of propagation was controlled by ΔK I only. The through-thickness fatigue cracks were generally noncrystallographic with fracture surfaces exhibiting striations in the [010], [011], and [111] crystals, but striation-covered ridges in the [211] specimen. These fracture modes are contrasted to crystallographic cracking along slip bands observed at ambient temperature. The difference in cracking behavior at 25 and 982 °C is explained on the basis of the propensity for homogeneous, multiple slip at the crack tip at 982 °C. The overall fracture mechanism is discussed in conjunction with Koss and Chan’s coplanar slip model.

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Authors and Affiliations

  1. Department of Materials Sciences, Southwest Research Institute, 6220 Culebra Road, P.O. Drawer 28510, 78284, San Antonio, TX

    K. S. Chan (Senior Research Engineer) & G. R. Leverant (Director)

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  1. K. S. Chan
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  2. G. R. Leverant
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Chan, K.S., Leverant, G.R. Elevated-temperature fatigue crack growth Behavior of MAR-M200 Single Crystals. Metall Trans A 18, 593–602 (1987). https://doi.org/10.1007/BF02649475

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