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Thin copper films by plasma CVD using copper-hexafluoro-acetylacetonate

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Abstract

Thin copper films are produced by plasma-enhanced chemical vapour deposition (PECVD) using copper-hexafluoro-acetylacetonate (CF3-CO-CH=C(O)-CF3)2Cu in argon-hydrogen mixtures. Film qualities depend on power density, gas flow, and substrate temperature. ESCA spectra show no Cu-F bonds in the films.

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Authors and Affiliations

  1. Institut für organische Chemie, Universität, D-7400, Tübingen, Fed. Rep. Germany

    C. Oehr & H. Suhr

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  1. C. Oehr
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  2. H. Suhr
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Oehr, C., Suhr, H. Thin copper films by plasma CVD using copper-hexafluoro-acetylacetonate. Appl. Phys. A 45, 151–154 (1988). https://doi.org/10.1007/BF02565202

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  • DOI: https://doi.org/10.1007/BF02565202

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