Abstract
We report on unique measurements of multiple microsecond-duration arrest periods during the propagation of high speed (>1 km s−1) cracks in micromachined single-crystal silicon specimens. These events were recorded electronically and in physical features remaining on the fracture plane. Using time-of-flight calculations, we have determined that these arrest patterns are due to the interference of boundary-reflected stress waves with the propagating crack tip. The specimen size, the measurement method, and the low acoustic attenuation in cyrstalline silicon facilitated the observation of these phenomena.
This is a preview of subscription content, log in via an institution to check access.
Similar content being viewed by others
References
Field, J.E., “Brittle Fracture: Its Study and Application,”Contemporary Physics,12,1–31 (1971).
Kanninen, M.F., “A Dynamic Analysis of Unstable Crack Propagation and Arrest in the DCB Test Specimen,”International Journal of Fracture,10,415–430 (1974).
Kamath, S.M. andKim, K.S., “On Rayleigh Wave Emissions in Brittle Fracture,”International Journal of Fracture,31,R57-R62 (1986).
Shmuely, M., Peretz, D., andPerl, M., “Effect of Rayleigh Waves in Dynamic Fracture Mechanics,”International Journal of Fracture,14,R69-R72 (1978).
Vu, B.Q. andKinra, V.K., “Brittle Fracture of Plates in Tension—Relative Significance of Boundary Reflected Body and Rayleigh Waves,”Engineering Fracture Mechanics,18,479–483 (1983).
Thaulow, C. andBurget, W., “The Emission of Rayleigh Waves from Brittle Fracture Initiation, and the Possible Effect of the Reflected Waves on Crack Arrest,”Fatigue and Fracture of Engineering Materials and Structures,13,327–346 (1990).
Wadley, H.N.G. andScruby, C.B., “Elastic Wave Radiation from Cleavage Crack Extension,”International Journal of Fracture,23,111–128 (1983).
Hull, R., ed., Properties of Crystalline Silicon, INSPEC (1998).
Kerkof, F., “Wave Fractographic Investigations of Brittle Fracture Dynamics,” International Conference on Dynamic Crack Propagation, G.C. Sih, ed., Noordhoff International Publishing, Bethlehem, 3–35 (1972).
Michalske, T.A. andFrechette, V.D., “Modified Sonic Technique for Crack Velocity Measurement,”International Journal of Fracture,17,251–256 (1981).
Gonzalez, A.C. andPantano, C.G., “A Compression-loaded Double Cantilever Beam Specimen,”Journal of the American Ceramic Society,73,2534–2535 (1990).
Fitzgerald, A.M., Iyer, R.S., Dauskardt, R.H. andKenny, T.W., “Subcritical Crack Growth in Single Crystal Silicon Using Micromachined Specimens,”Journal of Materials Research,17 (3),683–692 (2002).
Fitzgerald, A.M., Dauskardt, R.H. andKenny, T.W., “Fracture Toughness and Crack Growth Phenomena of Plasma-etched Single Crystal Silicon,”Sensors and Actuators A,83,194–199 (2000).
Liaw, P.K., Hartmann, H.R., andHelm, E.J., Eng. Fract. Mech.,18,121 (1983).
Dauskardt, R.H., Yu, W., andRitchie, R.O., J. Am. Ceram. Soc.,70 (10),C-248–C-252 (1987).
Russenberger, M.E., “Method and Apparatus for Determining the Time Dependency of the Length of a Fissure in a Test Specimen During a Fracture Test,” US Patent 4,149,406 (1979).
Auld, B. A., Acoustic Fields and Waves in Solids, Wiley, New York (1973).
Truell, R., Elbaum, C., andChick, B.B., Ultrasonic Methods in Solid State Physics, Academic Press, New York (1969).
Author information
Authors and Affiliations
Rights and permissions
About this article
Cite this article
Fitzgerald, A.M., Kenny, T.W. & Dauskardt, R.H. Stress wave interference effects during fracture of silicon micromachined specimens. Experimental Mechanics 43, 317–322 (2003). https://doi.org/10.1007/BF02410530
Received:
Revised:
Issue Date:
DOI: https://doi.org/10.1007/BF02410530