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Measurements of crack growth in a solid at elevated temperature by holographic interferometry

Paper describes an investigation into the possibility of monitoring crack growth over a prolonged period of time and at elevated temperature, using real-time holographic interferometry

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Abstract

Real-time holographic interferometry was used to follow the crack-opening displacement (COD) of a compact tension specimen of zirconium 2.5-percent niobium subjected to a constant tensile load at 120°C for a period of 860 h. This was made possible by a dimensionally stable invar plate placed beside the specimen as the reference for the alignment of holograms. A finite-element elasto-plastic stress-analysis code and measurements on a duplicate specimen with a clip gage were used to correlate the measured COD and the corresponding crack growth.

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References

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Hsu, T.R., Lewak, R. & Wilkins, B.J.S. Measurements of crack growth in a solid at elevated temperature by holographic interferometry. Experimental Mechanics 18, 297–302 (1978). https://doi.org/10.1007/BF02324160

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  • DOI: https://doi.org/10.1007/BF02324160

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