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Use of three-dimensional photoelasticity in fracture mechanics

An approach utilizing stress-freezing photoelasticity to obtain stress-intensity factors for three-dimensional problems is described which does not require stress separation

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Abstract

The philosophy of fracture mechanics is reviewed and utilized to formulate a simplified approach to the determination of the stress-intensity factor photoelastically for three-dimensional problems. The method involves a Taylor Series correction for the maximum in-plane shear stress (TSCM) and does not involve stress separation. The results are illustrated by applying the TSCM to surface flaws in bending fields. Other three-dimensional problems solved by the TSCM are cited.

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Abbreviations

K I :

Mode I stress-intensity factor [lb/(in.)3/2]

K IC :

critical Mode I stress-intensity factor [lb/(in.)3/2]

r, σ:

polar coordinates (in., rad)

a :

flaw depth (in.)

ρ:

radius of curvature of crack or notch root (in.)

2c :

flaw length in plate surface (in.)

t :

plate thickness (in.)

n :

fringe order

f :

material-fringe value (lb/in./order)

τmaxτm :

maximum shearing stress in plane perpendicular to crack border (psi)

τmo :

maximum remote shearing stress in plane perpendicular to crack border at plate surface (psi)

K ap :

apparent stress-intensity factor [lb/(in.)3/2]

K th :

theoretical stress-intensity factor [lb/(in.)3/2]

K TSCM :

approximate stress-intensity factor [lb/(in.)3/2]

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Authors and Affiliations

  1. Virginia Polytechnic Institute and State University, Blacksburg, VA

    C. William Smith (Professor of Engineering Science, and Mechanics)

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  1. C. William Smith
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Smith, C.W. Use of three-dimensional photoelasticity in fracture mechanics. Experimental Mechanics 13, 539–544 (1973). https://doi.org/10.1007/BF02322343

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