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Technology tools for a high precision accelerometer in bulk micromechanics

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Abstract

The high precision accelerometer consists of 5 silicon wafers and packages by silicon fusion bonding. The sensor has a capacitance measuring principle and works in an open loop or closed loop operation mode. The etching process for the realization of thin beams and seismic mass, the silicon fusion bonding and the metallization process are described.

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Authors and Affiliations

  1. Lehrstuhl Mikrotechnologie, Zentrum für Mikrotechnologien, Technische Universität Chemnitz-Zwickau, PSF 964, D-09009, Chemnitz, Germany

    T. Geßner & M. Wiemer

  2. LITEF GmbH, Lörracher Straße 18, D-79115, Freiburg i. Br., Germany

    E. Vetter

Authors
  1. T. Geßner
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  2. E. Vetter
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  3. M. Wiemer
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Geßner, T., Vetter, E. & Wiemer, M. Technology tools for a high precision accelerometer in bulk micromechanics. Microsystem Technologies 1, 10–13 (1994). https://doi.org/10.1007/BF01367755

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  • DOI: https://doi.org/10.1007/BF01367755

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