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Flaw growth in a polycrystalline lithium-aluminium-silicate glass ceramic

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Abstract

The growth of indentation-produced “controlled” flaws in a polycrystalline lithium-aluminium-silicate glass ceramic has been studied, over a wide range of temperatures and strain rates. Significant scatter in the fracture stress at elevated temperatures suggests that the extent of slow crack growth is highly sensitive to microstructural details. The initial flaw shape is important inK IC determination. Up to 1000° C the fracture toughness,K IC, is essentially strain-rate insensitive. The value ofK IC decreases with temperature beyond 850° C. Intergranular cavity formation is suggested as the reason. Crack blunting by diffusive crack healing probably occurs at high temperatures. Also, intergranular slow crack growth occurs essentially under Mode I loading.

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Author notes

  1. B. S. Majumdar

    Present address: Department of Mechanical Engineering, University of Rochester, 14627, Rochester, New York, USA

Authors and Affiliations

  1. Systems Research Laboratories Inc., 2800 Indian Ripple Road, 45440, Dayton, Ohio, USA

    B. S. Majumdar, T. Mah & M. G. Mendiratta

Authors
  1. B. S. Majumdar
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  2. T. Mah
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  3. M. G. Mendiratta
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Majumdar, B.S., Mah, T. & Mendiratta, M.G. Flaw growth in a polycrystalline lithium-aluminium-silicate glass ceramic. J Mater Sci 17, 3129–3139 (1982). https://doi.org/10.1007/BF01203475

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  • DOI: https://doi.org/10.1007/BF01203475

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