Abstract
A study is made on the density and deposition rate characteristics of chemical-vapour-deposited boron nitride (CVD-BN) plates synthesized by use of the BCl3-NH3-H2 system at a deposition temperature (T dep) of 1200 to 2000°C and a total gas pressure (P tot) of 5 to 60 torr. At aP tot of 5 torr, all the CVD-BN plates synthesized at eachT dep above 1300°C had a density greater than 2.O g cm−3, and thus showed no noticeable dependence onT dep. Over theP tot range from 10 to 60 torr. on the other hand, the density of the plates reached the maximum of 2.08g cm−3 at aT dep of 2000° C. AsT dep was lowered, the density decreased down to a minimum of 1.40 g cm−3 The deposition rate varied with bothT dep andP tot and showed a maximum value under a certainP tot at a givenT dep. The value ofP tot where the deposition rate becomes maximum changed depending on theT dep. The maximum deposition rate was 0.6 mm h−1 for the CVD-BN plates when the density was less than 2.0 g cm−3, and 0.4 mm h−1 when the density was above 2.0 g cm−3 The effects of deposition conditions on the characteristics of density and deposition rate are discussed in terms of the structure and deposition mechanism.
Similar content being viewed by others
References
T. Hirai, K. Niihara andT. Goto,J. Mater. Sci. 12 (1977) 632.
M. J. Rand andJ. F. Roberts,J. Electrochem. Soc. 115 (1968) 423.
W. Baronian,Mater. Res. Bull. 7 (1972) 119.
M. Hirayama andK. Shono,J. Electrochem. Soc. 122 (1975) 1671.
S. B. Hyder andT. O. Yep,ibid. 123 (1976) 1721.
T. Kimura, K. Yamamoto andS. Yugo,Jpn J. Appl. Phys. 17 (1978) 1871.
S. P. Murarka, C. C. Chang, D. N. K. Wang andT. E. Smith,J. Electrochem. Soc. 126 (1979) 1951.
A. C. Adams andC. D. Capio,ibid. 127 (1980) 399.
H. Miyamoto, M. Hirose andY. Osaka,Jpn J. Appl. Phys. 22 (1983) L216.
T. Matsuda, N. Uno, H. Nakae andT. Hirai,J. Mater. Sci. 21 (1986) 649.
J. Thomas, Jr, M. E. Weston andT. E. O'Connor,J. Amer. Chem. Soc. 82 (1962) 4619.
R. S. Pease,Acta Crystallogr. 5 (1952) 356.
M. Basche, US Patent 3 152006 (1964).
N. J. Archer,Spec. Publ. Chem. Soc. 30 (1977) 167.
H. O. Pierson,J. Compos. Mater. 9 (1975) 228.
J. Economy andR. V. Anderson,J. Polym. Sci. C 19 (1967) 283.
B. E. Warren,Phys. Rev. 59 (1941) 693.
T. Hirai andS. Yajima,J. Mater. Sci. 2 (1967) 18.
G. M. Jenkins, K. Kawamura andL. L. Ban,Proc. R. Soc. A327 (1972) 501.
G. Clerc andP. Gerlach, in Proceedings of 5th International Conference on Chemical Vapor Deposition, edited by J. M. Blocher, Jr, H. E. Hintermann and L. H. Hall (Electrochemical Society, Princeton, 1975) p. 777.
G. Malé andD. Salanoubat, in Proceedings of 7th International Conference on Chemical Vapor Deposition, edited by T. O. Sedgwick and H. Lydtin (Electrochemical Society, Princeton, 1979) p. 391.
J. M. Blocher, Jr,J. Vac. Technol. 11 (1974) 680.
W. A. Bryant,J. Mater. Sci. 12 (1977) 1285.
K. Nakamura,J. Electrochem. Soc. 132 (1985) 1757.
H. Hannache, R. Naslain andC. Bernard,J. Less-Common Metals 95 (1983) 221.
L. E. Branovich, M. L. Long andW. B. P. Fitzpatrick, AD Report 733292 (1971).
Author information
Authors and Affiliations
Rights and permissions
About this article
Cite this article
Matsuda, T., Nakae, H. & Irai, T. Density and deposition rate of chemical-vapour-deposited boron nitride. J Mater Sci 23, 509–514 (1988). https://doi.org/10.1007/BF01174677
Received:
Accepted:
Issue Date:
DOI: https://doi.org/10.1007/BF01174677