Abstract
Wood flour was used as a reinforcing filler for high-density polyethylene (HDPE). Different fibre treatments were carried out to improve the bonding at the polymer-fibre interface. Wood flour composites coated with alkoxy-silane coupling agents (silane A-172 and A-174) generally showed higher tensile strength and modulus values. A significant improvement in tensile properties was achieved with the addition of polymethylenepolyphenyl isocyanate. The Izod impact strength of the composites decreased with an increase in filler concentration.
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G. R. Lightsey, P. H. Short andV. K. K. Sinha,Polym. Engng. Sci. 17 (1977) 305.
A. D. Beshay, B. V. Kokta andC. Daneault,Polym. Compos. 6 (1984) 261.
R. T. Woodhams, G. Thomas andD. K. Rodgers,Polym. Engng. Sci. 24 (1984) 1166.
A. W. Mckenzie andJ. P. Yuritta,Appita 32 (1979) 460.
H. Dalvag, C. Klason andH. E. Stromvall,Int. J. Polym. Mater. 11 (1985) 9.
M. H. Schneider andK. I. Brenner,Wood Sci. Technol. 19 (1985) 67.
S. B. Driscoll, in Proceedings of 35th Annual Technical Conference, SPE, Montréal, 1977 p. 366.
G. Garcia, PhD thesis, Mississippi State University (1979).
A. Y. Coran andR. Patel, US Patent 4 323 625 (1982).
M. Xanthos,Plast. Rubber Proc. Appl. 3 (1983) 323.
S. J. Monte andG. Sugerman,Polym. Plast. Technol. Engng. 17 (1981) 95.
E. Goring,Chem. Ind. 32 (1980) 314.
R. G. Raj, B. V. Kokta, D. Maldas andC. Daneauet,J. Appl. Polym. Sci. in press.
W. E. Johns,J. Adhesion 15 (1982) 59.
R. G. Raj, F. Dembele, B. V. Kokta andB. Sanchagarian,J. Appl. Polym. Sci. in press.
E. A. Goettler, US Patent 4 376 144 (1983).
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Raj, R.G., Kokta, B.V. & Daneault, C. Wood flour as a low-cost reinforcing filler for polyethylene: studies on mechanical properties. J Mater Sci 25, 1851–1855 (1990). https://doi.org/10.1007/BF01045396
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DOI: https://doi.org/10.1007/BF01045396