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Electronic speckle pattern interferometry on a microscopic scale

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Abstract

An electronic speckle pattern interferometer that incorporates a commercial, long-working-distance microscope is described which provides new opportunities to perform nondestructive inspection for applications in fields such as microelectronics. The long-working-distance microscrope was attached directly to the CCD camera to form a compact, portable system with a field of view that was variable over several mm in width. Alignment was greatly simplified because the skewed Michelson interferometer configuration used a speckled reference beam imaged from a diffusely reflecting reference surface that was positioned adjacent to the test object. To demonstrate the performance of the micro-ESPI instrument, fringe patterns were recorded for the quasi-static cantilever deflection of a 1 mm-wide interconnect clip from an electronics socket.

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Authors and Affiliations

  1. Analytical Services & Materials, Inc., 107 Research Dr., 23666, Hampton, Virginia

    John B. Deaton Jr.

  2. Center for Nondestructive Evaluation, The Johns Hopkins University, 21218, Baltimore, Maryland

    James W. Wagner

  3. Nondestructive Evaluation Sciences Branch, NASA Langley Research Center, MS 231, 23681, Hampton, Virginia

    Robert S. Rogowski

Authors
  1. John B. Deaton Jr.
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  2. James W. Wagner
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  3. Robert S. Rogowski
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Deaton, J.B., Wagner, J.W. & Rogowski, R.S. Electronic speckle pattern interferometry on a microscopic scale. J Nondestruct Eval 13, 13–22 (1994). https://doi.org/10.1007/BF00723943

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  • DOI: https://doi.org/10.1007/BF00723943

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