References
A. R. NEUREUTHER, C. H. TING and C. LIU,IEEE Trans. Electron Devices ED-27 (1980) 1449.
H. P. BADER and M. A. LARDON,J. Vac. Sci. Technol. A3 (1985) 2167.
I. A. BLECH,Thin Solid Films 6 (1970) 113.
J. B. BINDELL and T. C. TISONE, ibid.23 (1974) 31.
I. A. BLECH,Solid State Technol. 26 (1983) 123.
D. J. HENDERSON, M. H. BRODSKY and P. CHAUDHARI,Appl. Phys. Lett. 25 (1974) 641.
H. J. LEAMY, G. H. GILMER and A. G. DIRKS,Curr. Top. Mater. Sci. 6 (1980) 309.
P. MEAKIN,CRC Crit. Rev. Mater. Sci. 13 (1987) 143.
M. SIKKENS, I. J. HODGKINSON, F. HOROWITZ, H. A. MACLEOD and J. J. WHARTON,Opt. Eng. 25 (1986) 142.
R. B. SARGENT, D. SANG and H. A. MACLEOD,J. Opt. Soc. A3 (1986) 54.
G. L. HANSEN and R. G. AHONEN,J. Vac. Sci. Technol. A5 (1987) 2898.
M. J. BRETT,J. Mater. Sci. in press (1988).
J. A. THORNTON,Ann. Rev. Mater. Sci. 7 (1977) 239.
J. M. NIEUWENHUISEN and H. B. HAANSTRA,Philips Tech. Rev. 27 (1966) 87.
M. J. BRETT,J. Vac. Sci. Technol. A6 (1988) 1749.
K. H. MULLER, ibid.A4 (1986) 184.
H. P. BADER and M. A. LARDON, ibid.B4 (1986) 833.
J. C. MITCHENER and I. MAHAWILI,Solid State Technol. 30 (1987) 109.
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Brett, M.J. Thin film deposition profiles using a ballistic aggregation model. J Mater Sci Lett 8, 415–417 (1989). https://doi.org/10.1007/BF00720691
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DOI: https://doi.org/10.1007/BF00720691