Abstract
Autocatalytic deposition of Ni-Cu-P alloys (55-65 wt % Ni, 25-35 wt % Cu, 7-10 wt %P) has been carried out. It is shown that the hypophosphite concentration must be higher than a certain threshold to induce the autocatalytic process. The impedance behaviour exemplifies the kinetic evolution: a large capacitive loop with a high-frequency inflection when only chemical displacement occurs and two well-defined capacitive features when the autocatalytic process is achieved. Mutual interactions occur between partial oxidation and reduction reactions which are both depolarized as compared to the separate reactions. In addition, phosphorus incorporation is always reduced when the copper content increases. A pH increase accelerates the plating process though it inhibits the cathodic discharge and reduces the copper content.
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References
W. Z. Friend,in “Corrosion of Nickel and Nickel Alloys”, Wiley Interscience, New York (1980) pp. 95–135.
M. Cherkaoui, E. Chassaing and K. Vu Quang,Surf. Coat. Technol. 34 (1988) 243.
M. Oulladj, M. Cherkaoui, E. Chassaing and K. Vu Quang,Galvano-Organo, April (1987) 333.
E. Chassaing, K. Vu Quang and R. Wiart,J. Appl. Electrochem. 17 (1987) 1267.
H. Loose,Oberfläche 10 (1971) 546.
Niculoy-22, Shipley Chemicals Ltd,Metal Finish. J., July (1971) 204.
S. K. Doss and P. B. P. Phipps,Plat. Surf. Finish. 72(4) (1985) 64.
R. G. Gusel'nikov and M. R. Burakov,Zashchita Metallov 10(1) (1974) 73.
F. Matsui and M. Saito,Denki Kagaku 38(9) (1987) 96.
L. Lacourcelle,Traitements de Surface 100 (Oct.) (1970) 1.
F. Pearlstein,in “Modern Electroplating”, Ed. F. A. Lowenheim, J. Wiley, New York (1974) p. 710.
A. Hung,Plat. Surf. Finish. 75(1) (1988) 62.
A. Hung and K. M. Chen,J. Electrochem. Soc. 136(1) (1989) 72.
M. Cherkaoui, A. Srhiri and E. Chassaing,Plat. Surf. Finish. 79(11) (1992) 68.
H. Wiese and K. G. Weil,Ber. Bunsenges. Phys. Chem. 91 (1987) 619.
A. H. Galin and S. W. Orchard,J. Appl. Electrochem. 22 (1992) 30.
U. Hofmann and K. G. Weil, ‘Dechema-Monographien’, VCH Verlagsgesellschaft (1990) p. 257.
A. Brenner,in ‘Electrodeposition of Alloys”, Vol 1, Academic Press, New York (1963) p. 77.
L. D. Burke and B. H. Lee,J. Appl. Electrochem. 22 (1992) 48.
A. J. Gould, P. J. Boden and S. J. Harris,Surf. Technol. 12 (1981) 93.
M. Pourbaix, “Atlas of Electrochemical Equilibria in Aqueous Solutions”, Pergamon Press, Oxford (1966) p. 504.
“Stability Constants”, Special publication no. 25, The Chemical Society, London (1971).
E. Chassaing, K. Vu Quang and R. Wiart,J. Appl. Electrochem. 16 (1986) 591.
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Chassaing, E., Cherkaoui, M. & Srhiri, A. Electrochemical investigation of the autocatalytic deposition of Ni-Cu-P alloys. J Appl Electrochem 23, 1169–1174 (1993). https://doi.org/10.1007/BF00625591
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DOI: https://doi.org/10.1007/BF00625591