Abstract
A survey on electrochemical codeposition of inert particles in a metallic matrix is given. Particles held in suspension in an electroplating bath are codeposited with the metal during electrodeposition. The particles used are inert to the bath and can be of different types, that is, pure metals, ceramics or organic materials. Combining this variety of types of particles with the different electrodeposited metals, electrochemical codeposition enables the production of a large range of composite materials with unique properties. Many experimental factors were found to influence the codeposition process, which led to some understanding of the mechanism. Models to predict the codeposition rate were developed, but were only partly successful.
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Abbreviations
- A :
-
constant in Tafel equation for metal deposition (V−1)
- B, B 1, B2 :
-
constants in Tafel equation for particle deposition (V−1)
- C ∞,C 0 :
-
concentration in bulk and at the cathode surface, respectively (mol m−3)
- C * :
-
number of ions or particles per unit volume in the bulk bath (m−3)
- Co :
-
dimensionless constant
- Cz K :
-
binomial constant
- Dm :
-
double layer dimensionless number
- F :
-
Faraday's constant (C mol−1)
- g :
-
acceleration due to gravity constant (m s−2)
- Gq :
-
particle embedment dimensionless number
- H :
-
hydrodynamic coefficient
- i :
-
current density (A m−2)
- i 0 :
-
exchange current density (A m−2)
- i tr :
-
transition current density (A m−2)
- k :
-
amount of adsorbed ions on particle that need to be reduced
- k * :
-
Langmuir adsorption constant
- k 1, k2, k3 :
-
rate constants for particle deposition (m4 mol−1 s−1)
- K :
-
amount of ions adsorbed on a particle
- M :
-
molecular weight (kg mol−1)
- n :
-
valence of electrodeposited metal
- N :
-
number of ions or particles crossing the diffusion layer per unit time and surface area (s−1 m−2)
- p i :
-
probability for an ion to be reduced
- P :
-
probability for a particle to become incorporated
- r p :
-
particle radius (m)
- Re :
-
Reynolds number
- Sh′:
-
modified Sherwood number
- Sx :
-
dimensionless number for bath particle concentration
- t :
-
time (s)
- v 0 :
-
constant for particle deposition (m s−1)
- V :
-
deposition rate (m s−1)
- W :
-
weight (kg)
- α:
-
measure of the interaction between free and adsorbed ions due to current density
- β:
-
volume percent of embedded particles
- δ:
-
diffusion layer thickness (m)
- ζ:
-
ζ-potential (V)
- ϑ:
-
strong adsorption coverage
- v :
-
solution viscosity (kg m−1 s−1)
- η:
-
overvoltage (V)
- Γ:
-
current efficiency
- ρ:
-
density (kg m−3)
- σ:
-
loose adsorption coverage
- e:
-
solution
- m:
-
metal
- p:
-
particle hydrogen
References
J. R. Roos, J. P. Celis, J. Fransaer and C. Buelens,J. Metals 42 (1990) 60.
J. P. Celis, J. R. Roos, C. Buelens and J. Fransaer,Trans. Inst. Met. Finish. 69 (1991) 133.
C. Buelens, J. Fransaer, J. P. Celis and J. R. Roos,Bull. Electrochem. 8 (1992) 371.
J. Fransaer, J. P. Celis, J. R. Roos,Met. Finish. 91 (1993) 97.
C. G. Fink and J. D. Prince,Trans. Am. Electrochem. Soc. 54 (1928) 315.
J. R. Roos and J. P. Celis, Proceedings AESF'84, New York (1984) p. 1.
J. R. Roos, Proceedings INCEF'86, Bangalore (1988) p. 382.
V. P. Greco and W. Baldauf,Plating 55 (1968) 250.
N. Periene, A. Cesuniene and L. Taicas,Plat. Surf. Finish. 80 (1993) 73.
Y. S. Chang and J. Y. Lee,Mater. Chem. Phys. 20 (1988) 309.
A. E. Grazen,Iron Age 183 (1959) 94.
F. Mathis, B. Pierragi, B. Lavelle and B. Criqui, Proceedings 24th ISATA, Florence (1991) p. 171.
T. W. Tomaszewski, R. J. Clauss and H. Brown,Proc. Am. Electroplaters Soc. 50 (1963) 169.
G. N. K. Ramesh Bapu and M. Mohammed Yusuf,Mat. Chem. Phys. 36 (1993) 134.
S. W. Watson,J. Electrochem. Soc. 140 (1993) 2235.
R. V. Williams and P. W. Martin,Trans. Inst. Met. Finish. 42 (1964) 182.
M. Keddam, S. Senyarich, H. Takenouti and P. Bernard,J. Appl. Electrochem. 24 (1994) 1037.
A. Anani, Z. Mao, S. Srinivasan and A. J. Appleby,ibid. 21 (1991) 683.
F. K. Sautter,J. Electrochem. Soc. 110 (1963) 557.
N. Guglielmi,ibid. 119 (1972) 1009.
R. Bazard and P. J. Boden,Trans. Inst. Met. Finish. 50 (1972) 63.
J. P. Celis, PhD thesis, Catholic University, Leuven (1976).
J. P. Celis and J. R. Roos,J. Electrochem. Soc. 124 (1977) 1508.
R. Narayama and B. H. Narayana,ibid. 128 (1981) 1704.
R. Narayan and S. Chattopadhyay,Surf. Technol. 16 (1982) 227.
Y. Suzuki and O. Asai,J. Electrochem. Soc. 134 (1987) 1905.
H. Guo, Q. Qin and A. Wang,Proc.-Electrochem. Soc. 88–18 (1988) 46.
J. W. Graydon and D. W. Kirk,J. Electrochem. Soc. 137 (1990) 2061.
M. Verelst, J. P. Bonino and A. Rousset,Mat. Sci. Eng. A135 (1991) 51.
H. Hayashi, S. Izumi and I. Tari,J. Electrochem. Soc. 140 (1993) 362.
P. K. N. Bartlett, Industrial training report AKZO, Arnhem, (1980) pp. 10–39.
E. A. Brandes and D. Goldthorpe,Metallurgia 76 (1967) 195.
T. W. Tomaszewski, L. C. Tomaszewski and H. Brown,Plating 56 (1969) 1234.
C. C. Lee and C. C. Wan,J. Electrochem. Soc. 135 (1988) 1930.
A. M. J. Kariapper and J. Foster,Trans. Inst. Met. Finish. 52 (1974) 87.
G. R. Lakshminarayanan, E. S. Chen and F. K. Sautter,Plat. Surf. Finish. 63 (1976) 38.
C. Buelens, PhD thesis, Catholic University, Leuven (1984).
S. H. Yeh and C. C. Wan,J. Appl. Electrochem. 24 (1994) 993.
C. Buelens, J. P. Celis and J. R. Roos,ibid. 13 (1983) 541.
J. P. Celis, J. R. Roos, C. Buelens,J. Electrochem. Soc. 134 (1987) 1402.
B. J. Hwang and C. S. Hwang,J. Electrochem. Soc. 140 (1993) 979.
S. W. Watson and R. P. Walters,ibid. 138 (1991) 3633.
Y. Suzuki, M. Wajima and O. Asai,ibid. 133 (1986) 259.
P. J. Sonneveld, W. Visscher and E. Barendrecht,J. Appl. Electrochem. 20 (1990) 563.
D. W. Gibbons, R. H. Muller and C. W. Tobias,J. Electrochem. Soc. 138 (1991) 3255.
P. R. Webb and N. L. Robertson,ibid. 141 (1994) 669.
J. Fransaer, J. P. Celis and J. R. Roos,ibid. 139 (1992) 413.
J. W. Graydon and D. W. Kirk,Can. J. Chem. Eng. 69 (1991) 564.
K. Helle, Proceedings, 4th International Conference in Organic Coating Science and Technology, Athens (1978) 264.
K. Helle, Report AKZO Research, Arnhem (1993).
K. Meguno, T. Ushida, T. Hiraoka and K. Esumi,Bull. Chem. Soc. Jpn. 60 (1987) 89.
J. C. Whithers,Prod. Fin. 26 (1962) 62.
R. S. Saifullin and R. G. Khalilova,J. Appl. Chem. USSR. 43 (1970) 1274.
M. Degrez and R. Winand,Electrochem. Acta 29 (1984) 365.
Z. Adamczyk,Colloids and Surfaces 35 (1989) 283.
J. L. Valdes,J. Electrochem. Soc. 134 (1987) 223C.
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Hovestad, A., Janssen, L.J.J. Electrochemical codeposition of inert particles in a metallic matrix. J Appl Electrochem 25, 519–527 (1995). https://doi.org/10.1007/BF00573209
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DOI: https://doi.org/10.1007/BF00573209