Abstract
The application of ultrasonic reflectivity for the characterization of a variety of copper diffusion bonds is described. The quality of each diffusion bond has been described by its ultimate tensile strength. Furthermore, fractography of the failed bonds provided information on the relative fraction of bonded areas as well as the geometry of the bonds. This paper provides the experimental results obtained as well as empirical correlations between the quantities determined.
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Palmer, D.D., Rehbein, D.K., Smith, J.F. et al. Nondestructive characterization of the mechanical strength of diffusion bonds. I. Experimental results. J Nondestruct Eval 7, 153–166 (1988). https://doi.org/10.1007/BF00565999
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DOI: https://doi.org/10.1007/BF00565999