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The temperature and strain rate dependence of the flow stress of tantalum

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Abstract

The temperature and strain rate dependence of the flow stress of tantalum was studied between 78 to 800 K at strain rates from 10−5 to 2×104 sec−1. The effect of temperature and strain rate on the lower yield stress can be explained by a model incorporating the combined operation of the Peierls mechanism and dislocation drag processes. The general behaviour of the stress—strain curve at various strain rates and temperatures is analysed in terms of a rate—temperature parameter.

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Authors and Affiliations

  1. Energy Research and Development Administration, Washington, D.C., USA

    K. G. Hoge

  2. Department of Mechanical Engineering and Materials and Devices Research Group, University of California, Davis, California, USA

    A. K. Mukherjee

Authors
  1. K. G. Hoge
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  2. A. K. Mukherjee
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Hoge, K.G., Mukherjee, A.K. The temperature and strain rate dependence of the flow stress of tantalum. J Mater Sci 12, 1666–1672 (1977). https://doi.org/10.1007/BF00542818

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  • DOI: https://doi.org/10.1007/BF00542818

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