Abstract
Enhanced diffusion of implanted arsenic impurities in silicon during subsequent thermal annealing can be interpreted in terms of a system of reaction-diffusion equations. It is shown that for high doses the local solubility limit can considerably influence the reactions between the defects involved and thus markedly change the effective diffusion of As donors. A similar effect can be brought about by the presence of predoped donors/acceptors, which also can significantly accelerate/retard the effective diffusion of As implants. Furthermore, an explanation of some precipitation/clustering processes during a rapid/slow cooling-down is proposed. Finally, several “contradictory” experimental results published previously will be shown to be compatible with the present model.
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References
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