Abstract
Extended lattice damage created by implantation of 3.6 MeV Au2+ ions has been investigated using transmission electron microscopy (TEM) and Rutherford backscattering spectrometry (RBS). Systematic observations of damage for Au2+ ions implanted with varying doses into silicon are explained in terms of a model. The origin of two distinct bands of extended defects is explained in terms of annealing of the central region of implant-damage, during the course of the implantation. Two distinct bands of Au precipitates are observed in high-dose implanted samples. This observation is explained as being the result, in part, of segregation of gold in front of a recrystallizing front, and in part, of gettering of dopant-atoms to nodes in a dislocation network. The network arises as a result of dynamic annealing of damaged crystalline silicon.
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Theodore, N.D., Alford, T.L., Carter, C.B. et al. TEM analysis of the influence of dose on damage behavior in MeV Au2+-implanted silicon. Appl. Phys. A 54, 124–131 (1992). https://doi.org/10.1007/BF00323898
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DOI: https://doi.org/10.1007/BF00323898