Summary
A simultaneous determination of nickel and palladium in plating baths was carried out at the hanging mercury drop electrode (HMDE), using the dc and ac single-sweep techniques, direct in the bath sample diluted with ammonia buffer. The influences of Co, Pb, Zn, Cd and the concentration of ammonia buffer on the peak shapes of Ni and Pd and on their resolution were studied. The possible determination of Cd and Pb contamination in plating baths in the same solution by anodic stripping voltammetry is also indicated. The essential advantages of the described method are: its simplicity, rapidity and very small consumption of mercury. The detailed analytical procedure is given. Relative standard deviations were found to be 3.1% for Pd and 2.6% for Ni.
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Golimowski, J., Najdeker, E. Voltammetric determination of nickel and palladium in plating baths. Fresenius J Anal Chem 339, 868–870 (1991). https://doi.org/10.1007/BF00321666
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DOI: https://doi.org/10.1007/BF00321666