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Interactive effects of cadmium, copper, manganese, nickel, and zinc on root growth of wheat (Triticum aestivum) in solution culture

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Plant Nutrition — Physiology and Applications

Part of the book series: Developments in Plant and Soil Sciences ((DPSS,volume 41))

Abstract

The interactive effects of cadmium (Cd), copper (Cu), manganese (Mn), nickel (Ni), and zinc (Zn) on growth of Triticum aestivum L. in solution culture were evaluated using conventional analysis of variance (ANOVA) of both root weight data and a root weight index (RWI) designed to identify antagonistic, synergistic, and multiplicative interactions. In all trials, Ni (0 to 60 µM) served as the primary metal stress, producing near complete inhibition of root growth at 60 µM. A single concentration of either Cd, Cu, Mn, or Zn provided a secondary stress which further reduced root growth in all but the highest Ni treatments. Analysis of variance of root weight data indicated significant Ni × Cd, Ni × Mn, and Ni × Zn interactions. Such interactions, however, may not have been indicative of biological interactions. When relative root growth was expressed as root weight above the empirical growth minimum (the RWI), only the Ni x Mn interaction was significant, indicating an antagonistic interaction (growth was greater than predicted by the multiplicative model). Differences in interpretation of root weight data and the derived RWI suggest caution is needed when using primary growth data to detect possible interactions between phytotoxic metals.

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© 1990 Kluwer Academic Publishers

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Taylor, G.J., Stadt, K.J. (1990). Interactive effects of cadmium, copper, manganese, nickel, and zinc on root growth of wheat (Triticum aestivum) in solution culture. In: van Beusichem, M.L. (eds) Plant Nutrition — Physiology and Applications. Developments in Plant and Soil Sciences, vol 41. Springer, Dordrecht. https://doi.org/10.1007/978-94-009-0585-6_54

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  • DOI: https://doi.org/10.1007/978-94-009-0585-6_54

  • Publisher Name: Springer, Dordrecht

  • Print ISBN: 978-94-010-6751-5

  • Online ISBN: 978-94-009-0585-6

  • eBook Packages: Springer Book Archive

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