Abstract
The purpose of this research is to introduce a numerical environmental assessment tool into computer aided design, and than makes designers accomplish design and inspection simultaneously. A new computer tool “EcoCAD” was developed according to the purpose. Its PCB-, electric component- and display component- environmental assessment on demand is based on the TPI (Toxic Potential Indicator) of Fraunhofer IZM and follows the UN’s GHS’ MSDS (Material Safety Data Sheet); and than incorporate into the SolidWorks API (Application Programming Interface) technique. Furthermore, EcoCAD can provide the corresponding suggestion with regard to the overall assessment (still in developing). A test MP3 player design case was successfully demonstrated the useful effect of EcoCAD in design and assessment process, and it indeed can reduce the R&D cost and manpower.
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References
Nissen, N.F., Griese, H., Middendrof, A. Müller, J., Pötter, H., Reichl, H. (1997): Environmental assessments of electronics: A new model to bridge the gap between full life cycle evaluations and product design. Proceedings of the 1997 IEEE International Symposium on Electronics and the Environment, Piscataway, NJ, May 5-7, pp. 182-187.
Nissen, N.F., Griese, H., Middendrof, A. Müller, J., Pötter, H., Reichl, H. (1998): An environmental comparison of packaging and interconnection technologies. Proceedings of the 1998 IEEE International Symposium on Electronics and the Environment, Oak Brook, IL, May 4-6, pp. 106-111.
Nissen, N.F., Griese, H., Middendrof, A. Müller, J., Pötter, H., Reichl, H. (1999): Environmental screening of packaging and interconnection technologies. Proceedings of EcoDesign'99: First International Symposium on Environmentally Conscious Design and Inverse Manufacturing, Tokyo, Japan, February 1-3, pp. 754-759.
Müller, J., Griese, H., Nissen, N.F., Pötter, H., Reichl, H. (1999): Environmental aspects of PCB microintegration. Proceedings of EcoDesign'99: First International Symposium on Environmentally Conscious Design and Inverse Manufacturing, Tokyo, Japan, February 1-3, pp. 216-220.
Middendrof, A., Nissen, N.F., Griese, H., Müller, J., Pötter, H., Reichl, H., Stobbe, I. (2000): EE-Toolbox: A modular assessment system for the environmental optimization of electronics. Proceedings of the 2000 IEEE International Symposium on Electronics and the Environment, May 8-10, San Francisco, CA, pp. 166-171
Schischke, K., Deubzer, O., Griese, H., Stobbe, I. (2002): LCA for Environmental Management and eco-design in the electronics industry: State of the art and screening approaches. Paper presented at the internet-based InLCA/LCM conference, May 20-25, www.lcacenter.org/lca-lcm/pdf/Electronics.pdf. Accessed May 2002.
Schischke, K., Griese, H., Müller, J., Reichl, H., Stobbe, I. (2002): Lean Environmental Management for Green Processes in Electronics Manufacturing - The Screening Assessment Tool ProTox, Paper presented at the Electronic Circuits World Convention, Cologne, Germany, October 7-9.
Yen, S.-B. and Chen, J.L. (2003): The development of Taiwan's toxic potential indicator (TPI). Proceedings of EcoDesign 2003: Third International Symposium on Environmentally Conscious Design and Inverse Manufacturing, Tokyo, Japan, December 8-11, pp. 632-635.
Yen, S.-B. and Chen, J.L. (2009): Calculation of a toxic potential indicator via Chinese-language material safety data sheets. Journal of Industrial Ecology 13(3), pp. 455-466.
Fujino, M., Suga, T., Hamano, H. (2005): Customization of the toxic potential indicator for Japanese regulation. Paper presented at EcoDesign 2005: Fourth International Symposium on Environmentally Conscious Design and Inverse Manufacturing, Tokyo, Japan, December 12-14.
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Chang, HT., Lu, CH. (2012). The Research on Integrating TPI Database with CAD API Technique for Environmental Design. In: Matsumoto, M., Umeda, Y., Masui, K., Fukushige, S. (eds) Design for Innovative Value Towards a Sustainable Society. Springer, Dordrecht. https://doi.org/10.1007/978-94-007-3010-6_156
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DOI: https://doi.org/10.1007/978-94-007-3010-6_156
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