Abstract
Avoiding wafer breakage is a big challenge in the photovoltaic silicon industry, limiting production yield and further price reduction. Special fracture strength tests suitable for thin silicon solar wafers and solar cells, to be used in combination with Weibull statistics, finite-element (FE) modelling and digital image correlation have been developed in order to study the mechanical stability of solar wafers. The results show that removal of the saw damage significantly increases the strength of crystalline silicon wafers. Furthermore, it was found that silicon crystallinity and the location where the wafer is extracted from the cast Si ingot have a significant effect on the strength, namely samples taken from the bottom of the ingot are 30% stronger than those taken from the top. The study also showed that there is a decrease in fracture strength when an anti-reflective SiNx coating is applied, which is caused by high thermal stresses.
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References
X.F. Brun, S.N. Melkote, Analysis of stresses and breakage of crystalline silicon wafers during handling and transport, Solar Energy Mater. & Solar Cells 93, 2009, pp. 1238–1247.
Budiman et al., Solar Energy Mater. & Solar Cells 130, 2014, p.303.
B.R. Lawn, Fracture of Brittle Solids, Cambridge University Press, 1993.
V.A. Popovich, A. Yunus, M. Janssen, I.M. Richardson, I.J. Bennett, Effect of silicon solar cell processing parameters and crystallinity on mechanical strength, Solar Energy Mater. & Solar Cells s 95, Issue 1, January 2011, pp. 97–100.
ASTM Standard C 1499–09, Standard test method for monotonic equibiaxial flexural strength of advanced ceramics at ambient temperature, American Society for Testing and Materials, West Conshohocken, PA, 2013.
Limess website, http://www.limess.com/index.php/en/digital-image-correlation
V.A. Popovich, A. Yunus, A.C. Riemslag, M. Janssen, I.J. Bennett, I.M. Richardson, Characterization of Multicrystalline Silicon Solar Wafers Fracture Strength and Influencing Factors, International Journal of Material Science, 3 (1), 2013.
P. Rupnowski, B. Sopori, Strength of silicon wafers: fracture mechanics approach, Int. J Fracture, 155, pp. 67–74, 2009.
C.-L. Tien and T.-W. Lin, Thermal expansion coefficient and thermomechanical properties of SiNx thin films prepared by plasma enhanced chemical vapour deposition, Applied Optics, 51 (30), pp. 7229–7235, 2012.
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© 2015 TMS (The Minerals, Metals & Materials Society)
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Popovich, V.A., Geerstma, W., Janssen, M., Bennett, I.J., Richardson, I.M. (2015). Mechanical Strength of Silicon Solar Wafers Characterized by Ring-On-Ring Test in Combination with Digital Image Correlation. In: Yurko, J.A., et al. EPD Congress 2015. Springer, Cham. https://doi.org/10.1007/978-3-319-48214-9_28
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DOI: https://doi.org/10.1007/978-3-319-48214-9_28
Publisher Name: Springer, Cham
Print ISBN: 978-3-319-48609-3
Online ISBN: 978-3-319-48214-9
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