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Microelectromechanical Systems and Packaging

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Materials for Advanced Packaging

Abstract

Microelectromechanical systems (MEMS) technology enables us to create different sensing and actuating devices integrated with microelectronic, optoelectronic, radiofrequency (RF), thermal, and mechanical devices for advanced microsystems. In all these systems that demand low cost and small size, MEMS packaging is usually a major consideration. The relationship between MEMS and packaging, however, is not limited to packaging of MEMS devices. MEMS devices can in fact be used to enhance packaging technologies for microelectronic, optoelectronic, and RF systems. In addition, packaging technologies can be applied to fabricate MEMS devices. Therefore, packaging and MEMS technologies are essential to integrate sensors and actuators with other components on a single system platform. There is a great opportunity to apply MEMS and packaging technologies to develop fully integrated micro/nanosystems for smartphones, wearable electronics, and Internet of Things (IoT).

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Acknowledgement

The first author is supported by the DARPA Micro Cryogenic Cooling (MCC) Program (W911NF-13-2-0029) and NSF Scalable Nano-manufacturing (SNM) project on Roll-to-Roll Atomic/Molecular Layer Deposition (CBET 1246854).

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Authors and Affiliations

  1. University of Colorado, Boulder, CO, 80309-0427, USA

    Y. C. Lee & Ming Kong

  2. Intel, Chandler, AZ, 85226, USA

    Yadong Zhang

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  1. Y. C. Lee
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Correspondence to Y. C. Lee .

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  1. Henkel China Co., Ltd, Shanghai, Shanghai, China

    Daniel Lu

  2. Materials Science and Engineering, Georgia Institute of Technology, Atlanta, Georgia, USA

    C.P. Wong

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Lee, Y.C., Kong, M., Zhang, Y. (2017). Microelectromechanical Systems and Packaging. In: Lu, D., Wong, C. (eds) Materials for Advanced Packaging. Springer, Cham. https://doi.org/10.1007/978-3-319-45098-8_16

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