Abstract
In this chapter a wide a range of examples—from the putative simple dip coating process, where a substrate is withdrawn from the coating solution at a constant rate, to the more advanced evaporation induced self-assembly (EISA) process, which leads to well-ordered nanostructured thin-film materials—is covered. In the first part the fundamentals of classical dip coating are presented. Various physical and chemical effects which influence the thickness and microstructure evolution are discussed. The film thickness is set by the competition among viscous force, capillary force, and gravity. Microstructure and properties of the film e.g. depend on the size and structure of the inorganic precursor species, the magnitude of the capillary pressure exerted during drying, and the relative rates of condensation and drying. After the basic aspects modified dip coating techniques which enable the coating of differently shaped substrates such as cylinders, tubes and bottles are briefly presented. Finally different aspects of the EISA process, which is based on the fact that in dip coating film formation occurs through evaporation of solvents concentrating the system in non-volatile species, is shortly reviewed. Thus by means of the silica/surfactant system it is presented how aggregation & gelation can be controlled and functional nanoscopic materials can be generated. It is also briefly shown that EISA can be used to simultaneously organize hydrophilic and hydrophobic precursors into hybrid nanocomposites that are optically or chemically polymerizable, patternable, or adjustable.
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Brinker, C.J. (2013). Dip Coating. In: Schneller, T., Waser, R., Kosec, M., Payne, D. (eds) Chemical Solution Deposition of Functional Oxide Thin Films. Springer, Vienna. https://doi.org/10.1007/978-3-211-99311-8_10
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